申请人:Honeywell International Inc.
公开号:US11041103B2
公开(公告)日:2021-06-22
The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.
本公开提供了一种无硅凝胶,可用于将发热电子设备(如计算机芯片)的热量传递到散热结构(如散热器和散热片)。热界面材料包括聚醚多元醇、交联剂、偶联剂、抗氧化剂、催化剂和至少一种导热填料。