The present invention provides a curable resin composition which exhibits the following properties : excellent basic performances such as heat resistance; sufficient optical characteristics such as transparency; and excellent demoldability when a molded body of the composition is demolded at the time of molding. The present invention further provides a molded body obtainable by molding the curable resin composition and a production method thereof. A curable resin composition for molded bodies, including a thermocurable resin, wherein the curable resin composition for molded bodies includes at least one compound selected from the group consisting a compound having a boiling point of 260° C. or less at one atmospheric pressure, a silicon compound having a polyoxyalkylene chain, a silicon compound having an aryl group, and a silicon compound having a polyoxyalkylene chain and an aryl group.
本发明提供了一种可固化
树脂组合物,具有以下性能:优异的基本性能,如耐热性;足够的光学特性,如透明度;以及当组合物的成型体在成型时脱模时具有优异的脱模性能。本发明还提供了一种通过成型可固化
树脂组合物获得的成型体及其生产方法。一种用于成型体的可固化
树脂组合物,包括热固性
树脂,其中成型体的可固化
树脂组合物包括以下至少一种化合物:在一大气压下沸点为260℃或以下的化合物,具有聚氧烷链的
硅化合物,具有芳基的
硅化合物,以及具有聚氧烷链和芳基的
硅化合物。