2-hydroxy-2-phenylpropionaldehyde dimethyl acetal | 104681-90-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-hydroxy-2-phenylpropionaldehyde dimethyl acetal
• 英文别名: 1,1-Dimethoxy-2-phenylpropan-2-ol
• CAS: 104681-90-5
• 化学式: C₁₁H₁₆O₃
• 分子量: 196.246
• InChiKey: YSVCSMQYYQVHDN-UHFFFAOYSA-N

物化性质

• 沸点：
  100-102 °C(Press: 1 Torr)
• 密度：
  1.070±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.1
• 重原子数：
  14
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.45
• 拓扑面积：
  38.7
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  2-hydroxy-2-phenylpropionaldehyde dimethyl acetal 在 盐酸 作用下， 以 水 、 丙酮 为溶剂， 反应 1.0h， 以2.36 g的产率得到2-hydroxy-2-phenylpropanal
  参考文献：
  名称：

  Lewis酸催化的Friedel-Crafts反应生成高度通用的α-季肟醚†

  摘要：

  通过路易斯酸催化的环状和无环2-羟基肟醚的弗里德-克拉夫茨烷基化反应，可以在温和的反应条件下以高收率进行全碳取代的季立体中心的合成。而且，肟醚部分可以通过随后的修饰容易地操纵成各种官能团。

  DOI：

  10.1039/c8cc06823b
• 作为产物：
  描述：

  溴苯 、 1,1-二甲氧基丙酮 在 magnesium 作用下， 以 四氢呋喃 为溶剂， 反应 1.0h， 生成 2-hydroxy-2-phenylpropionaldehyde dimethyl acetal
  参考文献：
  名称：

  Lewis酸催化的Friedel-Crafts反应生成高度通用的α-季肟醚†

  摘要：

  通过路易斯酸催化的环状和无环2-羟基肟醚的弗里德-克拉夫茨烷基化反应，可以在温和的反应条件下以高收率进行全碳取代的季立体中心的合成。而且，肟醚部分可以通过随后的修饰容易地操纵成各种官能团。

  DOI：

  10.1039/c8cc06823b

文献信息

• Chloromethyl(dimethyl)sulfonium Trifluoromethanesulfonate - The Reagent for Preparation of Acetals of 2-Hydroxyaldehydes from Ketones under Basic Conditions
  作者：Grzegorz Kaczmarczyk、Andrzej Jończyk

  DOI：10.1055/s-1997-939

  日期：1997.8

  2-Hydroxyaldehydes dimethylacetals 5 are synthesized via reaction of chloromethyl(dimethyl)sulfonium trifluoromethanesulfonate (1) with ketones 2, carried out in the presence of sodium methoxide in methanol. The corresponding 2-chloro- (3a) or 2-dimethylsulfonium-oxirane (3b) are presumably transient intermediates.

  2-羟基醛二甲基醚5是通过氯甲基(二甲基)磺鎓三氟甲磺酸盐(1)与酮2反应合成的，该反应在甲醇中存在甲氧基钠的条件下进行。相应的2-氯化物(3a)或2-二甲基磺鎓环氧化物(3b)可能是暂态中间体。
• Photosensitive resin composition and photosensitive films and laminates made by using the same
  申请人：——

  公开号：US20040265731A1

  公开（公告）日：2004-12-30

  A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

  本发明的光敏树脂组合物包含(A)可溶性聚酰亚胺和(b)(甲基)丙烯酸化合物，其中(A)可溶性聚酰亚胺可在有机溶剂中溶解，并通过使用酸性二酐组分和至少一种含有硅氧烷结构或芳香环结构的二胺组分以及结构中具有羟基、羧基或羰基的二胺组分合成，(B)(甲基)丙烯酸化合物具有至少一个碳-碳双键，并且最好包含至少一个(C)光反应引发剂和(D)阻燃剂。通过这种安排，本发明的光敏树脂组合物具有优异的性能。特别是，本发明的光敏树脂组合物非常有用，可以用于电子零件等。
• Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
  申请人：Okada Koji

  公开号：US20060199920A1

  公开（公告）日：2006-09-07

  A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.

  本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种（甲基）丙烯酸化合物(B)，其中基础树脂组分(A)是以下任何一种：具有至少一个羟基或羧基的聚酰亚胺树脂(A-1)；具有至少一个羟基或羧基的聚酰胺树脂(A-2)；和光敏亚胺（甲基）丙烯酰基硅氧烷低聚物(A-3)。因此，可以实现特性，例如(1)实现和改善水系开发性能，(2)改善作为亚胺化膜的实用性，(3)改善后固化性能，以及(4)简化印刷线路基板的制造。因此，该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
• Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
  申请人：——

  公开号：US20010056174A1

  公开（公告）日：2001-12-27

  An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.

  本发明的目的是提供一种环氧改性聚酰亚胺，它是一种能在低加工温度下处理的树脂，具有优异的耐热性；感光组合物；覆盖膜，它具有优异的电绝缘性能、焊接耐热性、成膜性、柔韧性和耐化学性；阻焊剂；以及印刷线路板。环氧改性聚酰亚胺是通过合成具有羟基或羧基的聚酰亚胺，然后使聚酰亚胺与环氧化合物反应而得到的。光敏组合物是通过向环氧改性聚酰亚胺中添加光反应引发剂或类似物而获得的。覆盖膜和阻焊可以由光敏组合物形成。使用覆盖膜和阻焊层生产出印刷线路板。
• Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board
  申请人：——

  公开号：US20040048978A1

  公开（公告）日：2004-03-11

  The present invention relates to a photosensitive resin composition having excellent heat resistance, processability, and adhesion, and a solder resist comprising the composition, a cover lay film, and a printed circuit board obtained from or with these. The cover lay film is excellent in processability and adhesion at relatively low temperatures and has a low elastic coefficient after curing while keeping sufficient mechanical strength, so that the cover lay film is preferably used for a printed circuit board or a hard disk. The cover lay film is soluble and can be laminated at temperatures of not higher than 150° C., and a solder resist having excellent properties, such as heat resistance which can be laminated directly onto FPC without any adhesives and a cover lay film having few warps when laminated onto the FPC can be provided according to the present invention. The photosensitive resin composition comprises as essential components: a soluble polyimide (A) dissolved in solvent having a boiling point of not higher than 120° C.; and a compound (B) having at least one aromatic ring and at least 2 double bonds in one molecule, wherein the soluble polyimide is one obtained at least from an acid dianhydride having 1 to 6 aromatic rings or alicyclic acid dianhydride and/or a diamine having 1 to 6 aromatic rings. The solder resist, cover lay film, etc. are excellent in heat resistance and mechanical properties and do not damage the substrate because they can be laminated at relatively low temperatures.

  本发明涉及一种具有优异的耐热性、加工性和附着力的光敏树脂组合物，以及一种由该组合物、覆盖层薄膜和印刷电路板组成的阻焊材料。覆盖膜在相对较低的温度下具有优异的加工性和附着力，固化后弹性系数低，同时保持足够的机械强度，因此覆盖膜最好用于印刷电路板或硬盘。根据本发明，盖层薄膜是可溶的，可以在不高于 150°C 的温度下层压，并且可以提供一种具有优异性能（如耐热性）的阻焊剂，这种阻焊剂可以不使用任何粘合剂直接层压到 FPC 上，并且层压到 FPC 上时盖层薄膜很少翘曲。光敏树脂组合物的主要成分包括：溶解在沸点不高于 120 摄氏度的溶剂中的可溶性聚酰亚胺（A）；以及在一个分子中至少具有一个芳香环和至少两个双键的化合物（B），其中可溶性聚酰亚胺至少是从具有 1 至 6 个芳香环的酸酐或脂环酸酐和/或具有 1 至 6 个芳香环的二胺中获得的。阻焊层、覆盖层薄膜等具有优异的耐热性和机械性能，并且不会损坏基材，因为它们可以在相对较低的温度下层压。