bis(4-aminophenoxy)phenylphosphine oxide | 2420-91-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: bis(4-aminophenoxy)phenylphosphine oxide
• 英文别名: bis-(4-aminophenyl)phenylphosphonate；Phosphonic acid, phenyl-, bis(4-aminophenyl) ester；4-[(4-aminophenoxy)-phenylphosphoryl]oxyaniline
• CAS: 2420-91-9
• 化学式: C₁₈H₁₇N₂O₃P
• 分子量: 340.318
• InChiKey: QMMNVVISTDJDIG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  24
• 可旋转键数：
  5
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  87.6
• 氢给体数：
  2
• 氢受体数：
  5

反应信息

• 作为产物：
  描述：

  1-硝基-4-[(4-硝基苯氧基)-苯基磷酰]氧基苯 在 盐酸 、 铁粉 作用下， 生成 bis(4-aminophenoxy)phenylphosphine oxide
  参考文献：
  名称：

  Synthesis and Characterization of Novel Phosphorus-Containing Polyurethane Elastomers

  摘要：

  以苯基二氯化膦和4-硝基苯酚为原料合成了双(4-氨基苯氧基)苯基氧化膦(BAPPO)，并通过傅里叶变换红外光谱(FTIR)和核磁共振(NMR)对其进行了表征。然后利用BAPPO通过改变软链段制备了一系列不同磷含量的含磷聚氨酯弹性体(PPUE)。通过热重分析（TGA）和微量燃烧量热法（MCC）研究了PPUE和聚氨酯弹性体（PUE）的燃烧行为和热降解行为。热重分析结果表明，聚氨酯弹性体的热降解分为两个阶段，PPUE-1的热稳定性较PUE差。 MCC结果表明，PPUE-1的峰值放热量和总放热量均低于3,3'-二氯-4,4'-二氨基二苯甲烷(MOCA)制得的PUE。相同的软段。

  DOI：

  10.14233/ajchem.2014.17223

文献信息

• 一种化合物二-（4-胺基苯基）苯基膦酸酯及其 合成方法
  申请人：武汉工程大学

  公开号：CN108912169B

  公开（公告）日：2021-03-30

  本发明公开了一种化合物二‑（4‑胺基苯基）苯基膦酸酯，其分子结构式如下所示：其合成方法为：在惰性气体氛围下，将对氨基苯酚和三乙胺溶解在溶剂中，并在冰水浴下冷却至0℃，然后加入催化剂，并将苯基膦酰二氯溶于溶剂中，在一定时间内滴加完毕，后再一定温度下反应数小时，经过过滤、沉淀、重结晶后得到最终产物。该化合物具有两个胺基，将其用以环氧树脂固化，同时可以提高环氧树脂的阻燃性能。
• Thermosetting resin composition, multilayer body using same, and circuit board
  申请人：Tanaka Shigeru

  公开号：US20060205891A1

  公开（公告）日：2006-09-14

  The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.

  本发明涉及适用于制造电路板（如柔性印刷电路板（FPC）和积层电路板）的热固性树脂组合物，以及使用这种热固性树脂组合物制造的多层板体和电路板。热固性树脂组合物包含聚酰亚胺树脂成分（A）、苯酚树脂成分（B）和环氧树脂成分（C）。按重量计的混合比 (A)/[(B)+(C)] 在 0.4 至 2.0 之间，按重量计的混合比是指组分 (A) 的重量与组分 (B) 和组分 (C) 的总重量之比。通过使用这种热固性树脂组合物，可以制造出在介电特性、粘合性、加工性、耐热性、流动性等方面都非常出色的多层板体和电路板。一种热固性树脂组合物含有聚酰亚胺树脂（A）、膦氮化合物（D）和氰酸酯化合物（E）。膦烯化合物（D）包括含酚羟基的苯氧基膦烯化合物（D-1）和/或通过交联苯氧基膦烯化合物（D-1）制备的交联苯氧基膦烯化合物（D-2），交联苯氧基膦烯化合物（D-2）具有至少一个酚羟基。通过使用这种热固性树脂组合物，可以制造出在介电特性、加工性、耐热性和阻燃性方面都非常出色的多层板体和电路板。
• Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board
  申请人：Tanaka Shigeru

  公开号：US20080306220A1

  公开（公告）日：2008-12-11

  The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the 4 phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
• DIELECTRIC COMPOSITE MATERIAL FOR FINGERPRINT SENSOR INDUCTION LAYER AND PREPARATION METHOD THEREOF
  申请人：TECORE SYNCHEM INC.

  公开号：US20170121520A1

  公开（公告）日：2017-05-04

  Provided is a dielectric composite material for a fingerprint sensor induction layer and a preparation method therefor, wherein the dielectric composite material is made from the following components: an epoxy resin, a phenolic resin, a first type of dielectric inorganic filler, a second type of dielectric inorganic filler, a curing agent, an adhesion promoter, a mould releasing agent and a flame retardant. The dielectric composite material has a high dielectric constant, a small dielectric loss, very stable dielectric properties which change very little with the test frequency, non-transparency and high hardness, such that the fingerprint sensor induction layer prepared therefrom satisfies the requirements of reliability and stability while reaching the thickness requirement, and can be used in various portable electronic products. The dielectric composite material for the fingerprint sensor induction layer is free of heavy metal lead, and is green and environmentally friendly. The dielectric composite material has convenience and high safety, and therefore the terminal application thereof can not only replace the existing digital-input password identification system, but can also be used on any electronic component in need of security.
• US7521511B2
  申请人：——

  公开号：US7521511B2

  公开（公告）日：2009-04-21