申请人:GENERAL ELECTRIC COMPANY
公开号:EP1285939A1
公开(公告)日:2003-02-26
Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant (11) may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.
已公开的环氧树脂组合物包括:(A) 至少一种环脂族环氧树脂;(B) 至少一种酸酐固化剂;(C) 至少一种基本上不含卤素的含硼催化剂;(D) 至少一种固化改性剂;以及(E) 可选的至少一种辅助固化催化剂。封装剂 (11) 还可选择包含热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。还公开了封装固态器件,包括封装、芯片(4)和由本发明环氧树脂组合物组成的封装剂(11)。还提供了一种封装固态器件的方法。