Benzoldisulfonsaeure-(1,3)-bis-<2-hydroxy-ethylamid> | 91717-14-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Benzoldisulfonsaeure-(1,3)-bis-<2-hydroxy-ethylamid>
• 英文别名: Benzoldisulfonsaeure-(1,3)-bis-(2-hydroxy-ethylamid)；1-N,3-N-bis(2-hydroxyethyl)benzene-1,3-disulfonamide
• CAS: 91717-14-5
• 化学式: C₁₀H₁₆N₂O₆S₂
• 分子量: 324.379
• InChiKey: DQZFFPJAXVADRN-UHFFFAOYSA-N

物化性质

• 熔点：
  110 °C
• 沸点：
  598.2±60.0 °C(Predicted)
• 密度：
  1.483±0.06 g/cm3(Temp: 20 °C; Press: 760 Torr)(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  -1.5
• 重原子数：
  20
• 可旋转键数：
  8
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  150
• 氢给体数：
  4
• 氢受体数：
  8

反应信息

• 作为产物：
  描述：

  1.3苯二磺酰氯 、 C.I.酸性橙108 以 N,N-二甲基甲酰胺 为溶剂， 生成 Benzoldisulfonsaeure-(1,3)-bis-<2-hydroxy-ethylamid>
  参考文献：
  名称：

  Effect of hydroxyl groups in receptors bearing disulfonamide on anion recognition in acetonitrile-d3

  摘要：

  To elucidate the roles of hydroxyl group on anion-recognition chemistry, receptors bearing disulfonamide and hydroxyl groups were prepared and their anion-binding properties were evaluated in acetonitrile. (C) 2002 Elsevier Science Ltd. All rights reserved.

  DOI：

  10.1016/s0040-4039(02)01543-5

文献信息

• NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE-TYPE LITHOGRAPHIC PRINTING ORIGINAL PLATE, AND METHOD FOR PRODUCING LITHOGRAPHIC PRINTING PLATE
  申请人：FUJIFILM Corporation

  公开号：EP3358408A1

  公开（公告）日：2018-08-08

  A negative type photosensitive resin composition includes a polymer compound which has, in a main chain thereof, a constitutional unit A represented by Formula A-1, a constitutional unit B that is at least one of constitutional units represented by Formulae B-1, B-2, B-3, B-4, B-5, B-6, or B-7, and a constitutional unit C containing an ethylenically unsaturated group; and a polymerization initiator. A negative type planographic printing plate precursor includes an image recording layer containing the negative type photosensitive resin composition. A method of preparing a planographic printing plate includes, in order, an exposure step of image-exposing the negative type planographic printing plate precursor; and a development step of performing development by removing a non-exposed portion of the exposed negative type planographic printing plate precursor using a developer.

  底片型感光树脂组合物包括一种聚合物化合物，其主链中具有由式 A-1 表示的构型单元 A、由式 B-1、B-2、B-3、B-4、B-5、B-6 或 B-7 表示的构型单元中至少一个构型单元 B 和含有乙烯不饱和基团的构型单元 C；以及一种聚合引发剂。 底片型平版印刷板前体包括含有底片型感光树脂组合物的图像记录层。 制备平版印刷板的方法依次包括：对底片型平版印刷板前体进行图像曝光的曝光步骤；以及使用显影剂去除已曝光的底片型平版印刷板前体的未曝光部分以进行显影的显影步骤。
• Photosensitive resin composition, planographic printing plate precursor, method for producing planographic printing plate, and polymer compound
  申请人：FUJIFILM CORPORATION

  公开号：US10363733B2

  公开（公告）日：2019-07-30

  Provided are a photosensitive resin composition which enables production of a lithographic printing plate precursor having a non-image portion which has good solubility in an alkali aqueous solution and which enables production of a lithographic printing plate having excellent chemical resistance and excellent printing durability, a lithographic printing plate precursor obtained by using the photosensitive resin composition, a method for producing a lithographic printing plate, and a new polymer compound. The photosensitive resin composition of the present invention contains: a polymer compound which has an amine bond or a quaternary ammonium salt bond, and at least one bond selected from the group consisting of a urea bond, a urethane bond, and a carbonate bond in the main chain and has a sulfonamide group or a phenolic hydroxyl group in the main chain and/or the side chain; and an infrared absorbing material.

  本发明提供了一种感光树脂组合物，该组合物能够生产出具有非图像部分的平版印刷版前体，该非图像部分在碱水溶液中具有良好的溶解性，并且能够生产出具有优异耐化学性和优异印刷耐久性的平版印刷版；还提供了一种通过使用该感光树脂组合物获得的平版印刷版前体、一种平版印刷版的生产方法以及一种新型聚合物化合物。本发明的感光树脂组合物包含：一种高分子化合物，其主链中具有胺键或季铵盐键，以及至少一个选自脲键、聚氨酯键和碳酸酯键的键，并且主链和/或侧链中具有磺酰胺基团或酚羟基团；以及一种红外线吸收材料。
• HYDROXY-FUNCTIONAL POLY(ETHER SULFONAMIDES) AS THERMOPLASTIC BARRIER RESINS
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0589939A1

  公开（公告）日：1994-04-06
• HYDROXY-PHENOXYETHER POLYMER THERMOPLASTIC COMPOSITES
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0929590A1

  公开（公告）日：1999-07-21
• HYDROXY ETHER POLYMERS AS THERMOPLASTIC BARRIER RESINS
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP1028989A1

  公开（公告）日：2000-08-23