Isoundecyl acrylate | 93804-09-2

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: Isoundecyl acrylate
• 英文别名: 9-methyldecyl prop-2-enoate
• CAS: 93804-09-2
• 化学式: C₁₄H₂₆O₂
• 分子量: 226.35
• InChiKey: QQWIPPMMELXTAR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.9
• 重原子数：
  16
• 可旋转键数：
  11
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.79
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• [EN] SURFACTANTS<br/>[FR] TENSIOACTIFS
  申请人：AMYRIS INC

  公开号：WO2012103156A1

  公开（公告）日：2012-08-02

  This application relates to derivatives of hydrocarbon terpenes (e.g., myrcene or farnesene), to methods of making the derivatives, and to the use of the derivatives as surfactants.

  这个应用涉及到碳氢化合物萜类化合物（例如，肉豆蔻烯或芬尼烯）的衍生物，制备这些衍生物的方法，以及将这些衍生物用作表面活性剂的用途。
• OXYGEN SCAVENGERS
  申请人：M&G USA Corporation

  公开号：US20140220281A1

  公开（公告）日：2014-08-07

  Described herein are oxygen scavengers, oxygen scavenging polymeric compositions, and oxygen scavenging articles. The polymeric compositions comprising the oxygen scavengers may have utility in packaging, sealing, wrapping, and storing oxygen-sensitive substances, e.g., to preserve freshness of foods, beverages, and the like.

  本文介绍了氧气清除剂、氧气清除聚合物组合物和氧气清除物品。含氧气清除剂的聚合物组合物可用于包装、封装、包裹和储存对氧气敏感的物质，例如保持食品、饮料等的新鲜度。
• ADHESIVE, ADHESIVE LAYER, AND ADHESIVE SHEET
  申请人：Nitto Denko Corporation

  公开号：EP2706102A1

  公开（公告）日：2014-03-12

  A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 19 to 99. 5% by weight of an alkyl (meth) acrylate having a branched alkyl group of 10 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.

  本发明的压敏粘合剂包括一种(甲基)丙烯酸基聚合物，它是由单体组分聚合而成，单体组分包括重量百分比为 19%至 99.5%的(甲基)丙烯酸烷基酯，该烷基酯的酯端具有 10 至 24 个碳原子的支链烷基。这种压敏胶具有令人满意的粘合性能，可形成介电常数较低的压敏胶层。
• ADHESIVE, ADHESIVE LAYER AND ADHESIVE SHEET
  申请人：Nitto Denko Corporation

  公开号：EP2762544A1

  公开（公告）日：2014-08-06

  A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.

  本发明的压敏粘合剂包括一种(甲基)丙烯酸基聚合物，由单体组分聚合而成，单体组分的重量百分比包括在酯端具有 10 至 18 个碳原子的烷基的(甲基)丙烯酸烷基酯 30 至 99.5%，以及含氮环状单体 0.5 至 50%。这种压敏粘合剂具有令人满意的粘合性能，可形成介电常数较低和防潮性能可靠的压敏粘合层。
• VINYL CHLORIDE RESIN COMPOSITION
  申请人：Kaneka Corporation

  公开号：EP3305844A1

  公开（公告）日：2018-04-11

  The present invention relates to a vinyl chloride resin composition containing 100 parts by weight of a vinyl chloride resin (A) and 0.1 to 20 parts by weight of a processing aid (B), wherein the processing aid (B) contains 50 to 95 % by weight of a first polymer (b1) and 5 to 50 % by weight of a second polymer (b2), the processing aid (B) has a weight average molecular weight of 100,000 to 4,000,000, the first polymer (b1) of the processing aid (B) has Tg of 5 to 110 °C, the first polymer (b1) of the processing aid (B) is polymerized with 12 to 28 % by weight of a vinyl cyanide compound, 32 to 88 % by weight of an aromatic vinyl compound, 0 to 40 % by weight of an alkyl acrylate, and 0 to 30 % by weight of other vinyl compound copolymerizable with the vinyl cyanide compound, the aromatic vinyl compound, and the alkyl acrylate, per 100 % by weight of the first polymer (b1), the second polymer (b2) of the processing aid (B) has Tg of -40 to 50 °C, and the first polymer (b1) has Tg of 40 °C or higher than that of the second polymer (b2) .

  本发明涉及一种氯乙烯树脂组合物，按重量计含有 100 份氯乙烯树脂 (A) 和 0.1至20份(重量)的加工助剂(B)，其中加工助剂(B)含有50至95%(重量)的第一聚合物(b1)和5至50%(重量)的第二聚合物(b2)，加工助剂(B)的重量平均分子量为100,000至4,000,000，加工助剂(B)的第一聚合物(b1)的Tg为5至110℃，加工助剂(B)的第一聚合物(b1)与12至28%(重量)的乙烯基氰化合物聚合、加工助剂(B)的第二种聚合物(b2)的 Tg 为 -40 至 50 °C，第一种聚合物(b1)的 Tg 为 40 °C或高于第二种聚合物(b2)的 Tg。