A siloxane resin exhibiting high transparency at a wavelength of 193 nm or less, very suitable as a resin component in a radiation-sensitive resin composition useful particularly for manufacturing LSIs, and a radiation-sensitive resin composition useful as a chemically-amplified resist exhibiting excellent depth of focus (DOF) and capability of remarkably decreasing development defects are provided.
The siloxane resin comprises the structural unit (I) shown by the following formula (I) and the structural unit (II) shown by the following formula (II) in the same molecule, the structural unit (I) and the structural unit (II) being included in an amount of more than 0 mol% but not more than 70 mol%,
wherein A and B individually represents a divalent linear, branched, or cyclic hydrocarbon group, R1 represents a monovalent acid-dissociable group, and R2 represents a linear, branched, or cyclic alkyl group.
The radiation-sensitive resin composition comprises (a) the siloxane resin and (b) a photoacid generator.
本发明提供了一种在 193 纳米或更低波长下具有高透明度的
硅氧烷树脂,它非常适合用作特别是用于制造 LSI 的辐射敏感
树脂组合物中的
树脂成分,还提供了一种用作
化学放大抗蚀剂的辐射敏感
树脂组合物,它具有优异的焦深(DOF)和显著减少显影缺陷的能力。
硅氧烷树脂在同一分子中包含下式(I)所示的结构单元(I)和下式(II)所示的结构单元(II),结构单元(I)和结构单元(II)的含量超过 0 摩尔%,但不超过 70 摩尔%、
其中 A 和 B 分别代表二价直链、支链或环状烃基,R1 代表一价酸可分解基团,R2 代表直链、支链或环状烷基。
辐射敏感
树脂组合物包括 (a)
硅氧烷树脂和 (b) 光酸发生器。