2-丙烯酸与2-丙烯酸丁酯和2-丙烯腈的聚合物 | 25686-45-7

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 中文名称: 2-丙烯酸与2-丙烯酸丁酯和2-丙烯腈的聚合物
• 英文名称: butyl prop-2-enoate;prop-2-enenitrile;prop-2-enoic acid
• CAS: 25686-45-7
• 化学式: C13H19NO4
• 分子量: 253.29
• InChiKey: QMRMTRCBDHFTIV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.47
• 重原子数：
  18
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  87.4
• 氢给体数：
  1
• 氢受体数：
  5

文献信息

• Damping compositions
  申请人：ROHM AND HAAS COMPANY

  公开号：EP0392766A2

  公开（公告）日：1990-10-17

  The use for damping is disclosed of polymeric compositions comprising at least two polymeric phases comprising a) a linear or lightly crosslinked polymeric phase, formed from at least one α,β-ethylenically unsaturated monomer of which from 0 to two percent by weight is multi-ethylenically unsaturated monomer, b) a further polymeric phase in the form of discrete domains of from 2 to 50 nanometers in diameter dispersed within phase (a), said further phase comprising polymer of at least one ethylenically unsaturated monomer itself comprising 5, preferably at least 50 and more preferably 100 percent by weight of monomer having at least two sites of ethylenic unsaturation, wherein the weight ratio of solids in said further phase to the total solids in both phases is from 1:100 to 1:2, optionally further with a final thermoplastic phase having a higher glass transition tmerpature than the first phase and being intimately attached to at least one of the other two phases. Damping compositions comprising a thermoset elastomer containing discrete domains of the above polymer are also disclosed.

  所公开的用于阻尼的聚合物组合物包含至少两个聚合物相，其中包括 a) 线性或轻度交联聚合物相，由至少一种 α、β-乙烯基不饱和单体形成，其中 0%至 2%（按重量计）为多乙烯基不饱和单体、 b) 另一种聚合物相，其形式为分散在（a）相中的直径为 2 至 50 纳米的离散结构 域，所述另一相包括至少一种乙烯基不饱和单体的聚合物，其本身含有 5%、优选 至少 50%、更优选 100%（重量百分比）的单体，这些单体具有至少两个乙烯基不 饱和位点、 其中，所述另一相中的固体与两相中总固体的重量比为 1:100 至 1:2、 最终热塑性相的玻璃化转变温度高于第一相，并至少与另外两相中的一相紧密相连。 此外，还公开了包含热固性弹性体的阻尼组合物，该弹性体含有上述聚合物的离散畴。
• Thermoplastic acrylic elastomers
  申请人：ROHM AND HAAS COMPANY

  公开号：EP0392767A2

  公开（公告）日：1990-10-17

  An improvement to two phase thermoplastic elastomer polymers comprising a final thermoplastic phase is disclosed. The polymers are useful in coatings, mastics, caulks, adhesives and articles, and comprises (a) a linear, or lightly crosslinked, polymeric phase, formed from at least one α,β-ethylenically unsaturated monomer of which no more than two percent by weight is multi-ethylenically unsaturated monomer, and (b) a further polymeric phase in the form of discrete domains of from 2 to 50 nanometers in diameter dispersed within phase, (a), said further phase comprising polymer comprising units of at least one ethylenically unsaturated monomer which itself comprises at least 5, preferably at least 50 and more preferably 100 percent by weight of monomer having at least two sites of ethylenic unsaturation, the weight ratio of solids in said further phase to total solids in both phases being from 1:100 to 1:2; characterised in that (c) the composition also contains subsequent polymeric phase which is thermoplastic and has a glass transition temperature higher than that of phase (a) and at least a portion of which subsequent phase is intimately attached to at least one of phases (a) and (b).

  本发明公开了一种由最终热塑性相组成的双相热塑性弹性体聚合物的改进产品。这种聚合物可用于涂料、胶粘剂、填缝剂、粘合剂和物品，包括 (a) 线性或轻度交联聚合物相，由至少一种 α、β-乙烯基不饱和单体形成，其中多元乙烯基不饱和单体的重量百分比不超过 2%，以及 (b) 另一种聚合物相，其形式为分散在（a）相中的直径为 2 至 50 纳米的离散结构 域，所述另一相包括由至少一种乙烯基不饱和单体单元组成的聚合物，该单体 本身含有至少 5%，最好是至少 50%，更理想的是 100%（按重量计）的单体， 该单体具有至少两个乙烯基不饱和位点，所述另一相中的固体与两相中总固 体的重量比为 1:100 至 1:2；其特征在于 (c) 组合物中还含有后续聚合物相，该相为热塑性，其玻璃化转变温度高于 (a) 相，且至少有一部分后续相与 (a) 相和 (b) 相中的至少一个相紧密相连。
• CONDUCTIVE CONNECTION MATERIAL, ELECTRONIC COMPONENT PRODUCING METHOD, AND ELECTRONIC MEMBER AND ELECTRONIC COMPONENT WITH CONDUCTIVE CONNECTION MATERIAL
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2519088A1

  公开（公告）日：2012-10-31

  Disclosed is a conductive connecting material 30 used to form conductive portions on a plurality of terminals 11 of an electronic member having a substrate 10 and the plurality of terminals 11 provided on the substrate 10, comprising a metal layer 110 and a resin layer 120 having a resin component and a filler, in which the metal layer is aggregated on each of terminals to form the conductive portions on the plurality of terminals by bringing the conductive connecting material into contact with the plurality of terminals and heating the conductive connecting material.

  所公开的是一种导电连接材料 30，用于在电子部件的多个端子 11 上形成导电部分，该电子部件具有基板 10 和设置在基板 10 上的多个端子 11，包括金属层 110 和具有树脂成分和填料的树脂层 120，其中金属层聚集在每个端子上，通过使导电连接材料与多个端子接触并加热导电连接材料，从而在多个端子上形成导电部分。
• ADHESIVE SHEET AND BONDING METHOD USING SAME
  申请人：Dai Nippon Printing Co., Ltd.

  公开号：EP2522704B1

  公开（公告）日：2016-01-06
• ADDITIVE, COMPOSITION COMPRISING IT AND USE THEREOF
  申请人：Ineos Europe AG

  公开号：EP2766438A1

  公开（公告）日：2014-08-20