申请人:MITSUI CHEMICALS, INC.
公开号:EP0953588A2
公开(公告)日:1999-11-03
An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) a curing agent, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1);
where R1 to R6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons. The epoxy-resin composition can be used for sealing a semiconductor integrated circuit in the manufacture of a semiconductor device.
一种环氧树脂组合物,包括(A)至少双官能环氧化合物和/或至少双官能环氧树脂,(B)固化剂和(C)促进剂,促进剂基本上含有通式(1)所代表的氧化膦;
其中 R1 至 R6 可以相同或不相同,均为氢、具有 1 至 10 个碳原子的直链、支链或环 烷基或具有 6 至 10 个碳原子的芳基或芳烷基。环氧树脂组合物可用于在制造半导体器件时密封半导体集成电路。