1-Tetratetracontanol | 236741-13-2

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: 1-Tetratetracontanol
• 英文别名: tetratetracontan-1-ol
• CAS: 236741-13-2
• 化学式: C₄₄H₉₀O
• 分子量: 635.2
• InChiKey: WUIWPYNTIMBIRN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  22.5
• 重原子数：
  45
• 可旋转键数：
  42
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• Adhesive sheet for processing semiconductor wafers and/or substrates
  申请人：Nitto Denko Corporation

  公开号：EP1914284A1

  公开（公告）日：2008-04-23

  An adhesive sheet for processing semiconductor wafers and / or substrates comprises a UV- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer comprises at least a tackifier and a surfactant. The adhesive sheet of the present invention can be to lower the adhesive strength to the optimal level during pick up or the like after irradiation with UV rays and/or radiation, while maintaining adhesion with adherends before irradiation with UV rays and/or radiation by ensuring that, regardless of the texture on the surface of adherends such as semiconductor wafers and/or substrates, the adhering surface favorably conforms to the texture with preserving enough adhesive and cohesive strength.

  一种用于加工半导体晶片和/或基片的粘合片包括可透过紫外线和/或辐射的基膜和通过紫外线和/或辐射进行聚合固化反应的粘合层，其中粘合层至少包括增粘剂和表面活性剂。本发明的粘合剂片材可以在紫外线和/或辐射照射后的拾取或类似拾取过程中将粘合强度降低到最佳水平，同时在紫外线和/或辐射照射前保持与被粘物的粘合力，确保无论半导体晶片和/或基板等被粘物表面的纹理如何，粘合表面都能在保持足够的粘合力和内聚力的情况下与纹理保持良好的吻合。
• Adhesive sheet for processing semiconductor substrates
  申请人：Nitto Denko Corporation

  公开号：EP1942166A1

  公开（公告）日：2008-07-09

  An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.

  一种用于加工半导体基片的粘合剂片材，包括可透过紫外线和/或辐射的基膜和通过紫外线和/或辐射进行聚合固化反应的粘合剂层，其中粘合剂层是使用具有双键的多功能丙烯酸酯低聚物和/或单体形成的，其混合方式是根据多功能丙烯酸酯低聚物和/或单体的重量平均分子量确定，每225至8000的总平均分子量中含有1个双键。
• PRESSURE SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR SUBSTRATE PROCESSING
  申请人：Nitto Denko Corporation

  公开号：EP2100934A1

  公开（公告）日：2009-09-16

  An object of the present invention is to provide a stable adhesive sheet in which the disappearance of the laser-printings prevents almost entirely, without leaving adhesive residue whatsoever during the cut of the substrate. An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer has a thickness of 7 to 15 µm.

  本发明的目的是提供一种稳定的粘合片，几乎完全防止激光打印的消失，在切割基板时不会留下任何粘合剂残留物。一种用于加工半导体基片的粘合片包括一层可透射紫外线和/或辐射的基膜和一层通过紫外线和/或辐射进行聚合固化反应的粘合层，其中粘合层的厚度为 7 至 15 微米。
• ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES
  申请人：SHINTANI Toshio

  公开号：US20080118764A1

  公开（公告）日：2008-05-22

  An adhesive sheet for processing semiconductor wafers and/or substrates comprises a UV- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer comprises at least a tackifier and a surfactant. The adhesive sheet of the present invention can be to lower the adhesive strength to the optimal level during pick up or the like after irradiation with UV rays and/or radiation, while maintaining adhesion with adherends before irradiation with UV rays and/or radiation by ensuring that, regardless of the texture on the surface of adherends such as semiconductor wafers and/or substrates, the adhering surface favorably conforms to the texture with preserving enough adhesive and cohesive strength.
• ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES
  申请人：Yamamoto Akiyoshi

  公开号：US20080261038A1

  公开（公告）日：2008-10-23

  An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.