SELECTIVE COATING OF EXPOSED COPPER ON SILVER-PLATED COPPER
申请人:HENKEL IP & HOLDING GMBH
公开号:US20140295200A1
公开(公告)日:2014-10-02
Silver-plated copper particles in which any exposed copper not plated with silver are coated with a polymer or with a chelating compound capable of preventing oxidation of the exposed copper. A method for preventing oxidation of any exposed copper on silver-plated copper particles and for improving the conductivity of silver-plated copper particles comprises coating a polymer or a copper-chelating compound onto the exposed copper on the silver-plated copper particles.
FERROELECTRIC ADHESIVE COMPOSITION
申请人:Henkel AG & Co. KGaA
公开号:US20170306190A1
公开(公告)日:2017-10-26
The present invention relates to a ferroelectric adhesive composition comprising from 2 to 50% of an adhesive matrix, from 5 to 85% of a ferroelectric component, wherein all weight percentages are based on weight of the total weight of the composition, and wherein said ferroelectric component is in a ferroelectric phase. The ferroelectric adhesive composition according to the present invention can be used as a sensor, an emitter or as a generator in an energy harvester. Furthermore, the present invention also encompasses a device comprising a ferroelectric adhesive composition according to the present invention between two conductive elements.
US7230055B2
申请人:——
公开号:US7230055B2
公开(公告)日:2007-06-12
[EN] A FERROELECTRIC ADHESIVE COMPOSITION<br/>[FR] COMPOSITION ADHÉSIVE FERROÉLECTRIQUE
申请人:HENKEL AG & CO KGAA
公开号:WO2016097077A1
公开(公告)日:2016-06-23
The present invention relates to a ferroelectric adhesive composition comprising from 2 to 50 % of an adhesive matrix, from 5 to 85 % of a ferroelectric component, wherein all weight percentages are based on weight of the total weight of the composition, and wherein said ferroelectric component is in a ferroelectric phase. The ferroelectric adhesive composition according to the present invention can be used as a sensor, an emitter or as a generator in an energy harvester. Furthermore, the present invention also encompasses a device comprising a ferroelectric adhesive composition according to the present invention between two conductive elements.
Compositions containing oxetane compounds for use in semiconductor packaging