benzene-1,4-dicarboxylic acid bis((3-ethyl-3-oxetanyl)methyl ester) | 63943-89-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: benzene-1,4-dicarboxylic acid bis((3-ethyl-3-oxetanyl)methyl ester)
• 英文别名: 1,4-Benzendicarboxylic acid, bis{[3-ethyl-3-oxetanyl]methyl}ester；1,4-benzenedicarboxylic acid-bis[(3-ethyl-3-oxetanyl)methyl]ester；4-benzenedicarboxylic acid-bis[(3-ethyl-3-oxetanyl) methyl] ester；p-benzenedicarboxylic acid bis[(3-ethyl-3-oxetanyl)methyl] ester；bis[(3-ethyl-3-oxetanyl)methyl] 1,4-benzenedicarboxylate；terephthalic acid bis[(3-ethyl-3-oxetanyl)methyl ester]；terephthalic acid bis-(3-ethyl-oxetan-3-ylmethyl)ester；1,4-bis[(3-ethyloxetan-3-yl)methyloxycarbonyl]benzene；bis[(3-ethyl-3-oxetanyl)methyl] terephthalate；Bis[(3-ethyloxetan-3-yl)methyl] benzene-1,4-dicarboxylate
• CAS: 63943-89-5
• 化学式: C₂₀H₂₆O₆
• 分子量: 362.423
• InChiKey: HEYYMASVKJXRDV-UHFFFAOYSA-N

物化性质

• 沸点：
  473.4±15.0 °C(Predicted)
• 密度：
  1.156±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  26
• 可旋转键数：
  10
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.6
• 拓扑面积：
  71.1
• 氢给体数：
  0
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  3-乙基-3-氧杂丁环甲醇 、 对苯二甲酰氯 在 4-二甲氨基吡啶 、 三乙胺 作用下， 以 二氯甲烷 为溶剂， 反应 24.0h， 生成 benzene-1,4-dicarboxylic acid bis((3-ethyl-3-oxetanyl)methyl ester)
  参考文献：
  名称：

  Compositions containing oxetane compounds for use in semiconductor packaging

  摘要：

  公开号：

  EP1621534B1

文献信息

• [EN] CATIONICALLY CURABLE COMPOSITIONS WITH LATENT REDUCING AGENT DEMONSTRATING LOW CURE TEMPERATURE<br/>[FR] COMPOSITIONS DURCISSABLES CATIONIQUEMENT AVEC UN AGENT DE RÉDUCTION LATENT PRÉSENTANT UNE BASSE TEMPÉRATURE DE DURCISSEMENT
  申请人：HENKEL IP & HOLDING GMBH

  公开号：WO2020006159A1

  公开（公告）日：2020-01-02

  Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

  提供了具有潜在还原剂的阳离子可固化组合物，表现出低固化温度和改善的工作寿命。
• OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF
  申请人：HENKEL IP & HOLDING GMBH

  公开号：US20140209951A1

  公开（公告）日：2014-07-31

  Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.

  提供含有氧杂环丙烷化合物、含有羧酸、潜隐羧酸和/或具有羧酸和潜隐羧酸功能的化合物的组合物。这些含氧杂环丙烷化合物及其组成物在LED器件的组件和组装中特别有用，可用作粘合剂、密封剂和封装剂。
• POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE INCLUDING CURED FILM USING THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20150212412A1

  公开（公告）日：2015-07-30

  The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X 1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X 2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.

  本发明提供了一种正型光敏树脂组合物，能够获得低翘曲性的固化膜，并且在低于250℃的较低温度下烧结时具有高灵敏度和高分辨率。本发明揭示了一种正型光敏树脂组合物，包括（a）聚酰亚胺树脂，包括由一般式（1）表示的结构单元和由一般式（2）表示的结构单元，以及（b）喹喔啉二酮化合物。其中，聚酰亚胺树脂包括由一般式（1）表示的结构单元和由一般式（2）表示的结构单元，其酰亚胺化比例为85％或更高，并且一般式（1）表示的结构单元与一般式（2）表示的结构单元的比例在30:70至90:10的范围内，其中，一般式（1）中的X1表示包括1至4个芳香环的四羧酸残基，Y1表示包括1至4个芳香环的芳香二胺残基，一般式（2）中的X2表示包括1至4个芳香环的四羧酸残基，Y2表示主链中包含至少两个或更多的烷基二醇单元的二胺残基。
• INSULATING SHEET AND LAMINATED STRUCTURE
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2316897A1

  公开（公告）日：2011-05-04

  The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

  本发明提供了一种绝缘片材，它在未固化时具有极佳的可操作性，可防止在层压机中过度流动，并可提供具有极佳的介电击穿特性、导热性、耐热性和可加工性的固化产品。用于将导热系数为 10 W/m-K 或更高的热导体与导电层粘合的绝缘片材，包括(A) 具有 10,000 或以上重量平均分子量的聚合物；(B) 具有芳香族骨架且重量平均分子量为 600 或以下的环氧单体 (B1) 和具有芳香族骨架且重量平均分子量为 600 或以下的氧杂环丁烷单体 (B2) 中的至少一种；(C) 固化剂；(D) 20-60%（体积）的第一种无机填料；以及 (E) 1-40%（体积）的有机填料（E1）和第二种无机填料（E2）中的至少一种，第二种无机填料与第一种无机填料（D）不同，其新莫氏硬度为 3 或更低；当填料（E）包含有机填料（E1）时，有机填料（E1）的比例为 3-40%（体积）。
• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE CONTAINING A CURED FILM USING SAID COMPOSITION
  申请人：Toray Industries, Inc.

  公开号：EP2902847A1

  公开（公告）日：2015-08-05

  The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250°C or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.

  本发明提供了一种正型感光树脂组合物，该组合物能够获得低翘曲的固化膜，并且在 250°C 或更低温度下烧制时具有优异的高灵敏度和高分辨率。本发明公开了一种正型感光树脂组合物，包括 (a) 聚酰亚胺树脂（包括通式 (1) 所代表的结构单元和通式 (2) 所代表的结构单元）和 (b) 喹螨酯化合物、其中，包括通式(1)代表的结构单元和通式(2)代表的结构单元的聚酰亚胺树脂的亚胺化率为85%或以上，通式(1)代表的结构单元与通式(2)代表的结构单元的比例范围为30：通式（1）中的 X1 代表包括 1 至 4 个芳香环的四羧酸残基，Y1 代表包括 1 至 4 个芳香环的芳香二胺残基，通式（2）中的 X2 代表包括 1 至 4 个芳香环的四羧酸残基，Y2 代表主链中至少包括两个或更多亚烷基二醇单元的二胺残基。