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6-ethyl-5-butyl-2-thioxo-2,3-dihydro-1H-pyrimidin-4-one | 99167-36-9

中文名称
——
中文别名
——
英文名称
6-ethyl-5-butyl-2-thioxo-2,3-dihydro-1H-pyrimidin-4-one
英文别名
6-Aethyl-5-butyl-2-thioxo-2,3-dihydro-1H-pyrimidin-4-on;5-Butyl-6-ethyl-2-thiouracil;5-butyl-6-ethyl-2-sulfanylidene-1H-pyrimidin-4-one
6-ethyl-5-butyl-2-thioxo-2,3-dihydro-1<i>H</i>-pyrimidin-4-one化学式
CAS
99167-36-9
化学式
C10H16N2OS
mdl
——
分子量
212.316
InChiKey
CVUUUVXCTJCXGC-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 密度:
    1.14±0.1 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    2.3
  • 重原子数:
    14
  • 可旋转键数:
    4
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.6
  • 拓扑面积:
    73.2
  • 氢给体数:
    2
  • 氢受体数:
    2

SDS

SDS:e1725deb1fa089ca1e576366b1000f88
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上下游信息

  • 下游产品
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

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文献信息

  • Positive working photosensitive material
    申请人:AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
    公开号:US10976662B2
    公开(公告)日:2021-04-13
    The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.
    本专利申请涉及一种感光性正片工作感光组合物,特别适用于厚膜成像,该组合物可提供非常好的胶片均匀性,并在这些胶片成像和显影过程中,促进良好的加工纬度,防止图案特征崩溃。
  • POSITIVE WORKING PHOTOSENSITIVE MATERIAL
    申请人:AZ Electronic Materials (Luxembourg) S.à.r.l.
    公开号:EP3446180B1
    公开(公告)日:2020-04-01
  • SILICON ETCHING LIQUID, SILICON ETCHING METHOD, AND MICROELECTROMECHANICAL ELEMENT
    申请人:MITSUBISHI GAS CHEMICAL COMPANY, INC.
    公开号:US20150340241A1
    公开(公告)日:2015-11-26
    The present invention is able to provide: a silicon etching liquid which anisotropically dissolves single crystal silicon, and which is characterized by containing (1) potassium hydroxide or sodium hydroxide, (2) a hydroxyl amine and (3) a cyclic compound represented by general formula (I), which has a thiourea group and wherein N and N′ are linked; and a silicon etching method which uses this silicon etching liquid. (In general formula (I), Q represents an organic group having a saturated or unsaturated carbon-carbon bond.) By using the above-described silicon etching liquid, high etching rate can be achieved without lowering the etching rate of silicon and stability of the etching liquid is not impaired even in cases where copper is present in the etching liquid and/or where copper ions are dissolved in the etching liquid.
  • CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD FOR MANUFACTURING PLATED ARTICLE
    申请人:TOKYO OHKA KOGYO CO., LTD.
    公开号:US20190278178A1
    公开(公告)日:2019-09-12
    A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having excellent cross-sectional perpendicularity of a nonresist section even when a resist pattern is formed on a metal surface, and a method for manufacturing a substrate with a template and a method for manufacturing a plated article using the composition. The composition contains an acid generator, a resin, and a sulfur-containing compound including a sulfur-containing compound and a thiol compound that is different from the sulfur-containing compound.
  • US9875904B2
    申请人:——
    公开号:US9875904B2
    公开(公告)日:2018-01-23
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