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Ethyl phenoxycarbamate | 15171-62-7

中文名称
——
中文别名
——
英文名称
Ethyl phenoxycarbamate
英文别名
ethyl N-phenoxycarbamate
Ethyl phenoxycarbamate化学式
CAS
15171-62-7
化学式
C9H11NO3
mdl
——
分子量
181.191
InChiKey
OILFVDKXWWPVNO-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2.2
  • 重原子数:
    13
  • 可旋转键数:
    4
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.22
  • 拓扑面积:
    47.6
  • 氢给体数:
    1
  • 氢受体数:
    3

反应信息

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文献信息

  • Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
    申请人:Okada Koji
    公开号:US20060199920A1
    公开(公告)日:2006-09-07
    A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.
    本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种(甲基)丙烯酸化合物(B),其中基础树脂组分(A)是以下任何一种:具有至少一个羟基或羧基的聚酰亚胺树脂(A-1);具有至少一个羟基或羧基的聚酰胺树脂(A-2);和光敏亚胺(甲基)丙烯酰基硅氧烷低聚物(A-3)。因此,可以实现特性,例如(1)实现和改善水系开发性能,(2)改善作为亚胺化膜的实用性,(3)改善后固化性能,以及(4)简化印刷线路基板的制造。因此,该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
  • Phosphazene compound, photosensitive resin composition and use thereof
    申请人:Okada Koji
    公开号:US20060142542A1
    公开(公告)日:2006-06-29
    Disclosed is a phosphazene compound and a photosensitive resin composition. The phosphazene compound is obtained by reacting a phenoxyphosphazene compound (A-1) having a phenolic hydroxyl group and/or a cross-linked phenoxyphosphazene compound (A-2) obtained by cross-linking the phenoxyphosphazene compound (A-1) with an epoxy compound (B) having an unsaturated double bond and/or an isocyanate compound (C), wherein the phosphazene compound has an unsaturated double bond in its molecule. The photosensitive resin composition includes at least: a soluble polyimide resin (G-1) having a carboxyl group and/or a hydroxyl group and is soluble in an organic solvent, as the polyimide resins (G); and a phenoxyphosphazene compound (H-1) having a phenolic hydroxyl group and/or a cross-linked phenoxyphosphazene compound (H-2), which is obtained by cross-linking the phenoxyphosphazene compound (H-1) and has at least one phenolic hydroxyl group, as the phosphazene compound (H), and the photosensitive resin composition further includes a (meth)acrylic compound (L).
    本发明公开了一种膦氮化合物和一种感光树脂组合物。膦氮化合物是由具有酚羟基的苯氧基膦氮化合物(A-1)和/或通过将苯氧基膦氮化合物(A-1)与具有不饱和双键的环氧化合物(B)和/或异氰酸酯化合物(C)交联而得到的交联苯氧基膦氮化合物(A-2)反应得到的,其中膦氮化合物分子中具有不饱和双键。光敏树脂组合物至少包括具有羧基和/或羟基并可溶于有机溶剂的可溶性聚酰亚胺树脂 (G-1),如聚酰亚胺树脂 (G);和具有酚羟基的苯氧基膦氮化合物(H-1)和/或交联苯氧基膦氮化合物(H-2),后者通过交联苯氧基膦氮化合物(H-1)而得到,具有至少一个酚羟基,作为膦氮化合物(H),感光树脂组合物还包括(甲基)丙烯酸化合物(L)。
  • COMPOSITE LAMINATE FLAME BARRIER FOR A THERMAL AND ACOUSTIC INSULATION BLANKET
    申请人:E I DU PONT DE NEMOURS AND COMPANY
    公开号:US20170217120A1
    公开(公告)日:2017-08-03
    A multilayer laminate comprising in order, a polymeric film layer capable of withstanding a temperature of at least 200 C for at least 10 min, an adhesive layer having an areal weight of from 2 to 40 gsm capable of activation at a temperature of from 75 to 200 degrees C. and an inorganic refractory layer wherein the refractory layer comprises platelets in an amount at least 85% by weight with a dry areal weight of 15 to 50 gsm and has a residual moisture content of no greater than 10 percent by weight.
  • US4025694A
    申请人:——
    公开号:US4025694A
    公开(公告)日:1977-05-24
  • US4709991A
    申请人:——
    公开号:US4709991A
    公开(公告)日:1987-12-01
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