The invention relates to a dual-curing solvent-free single-component mass for the bonding, molding, sealing and coating of substrates, in particular of electronic components. The mass comprises an at least bifunctional epoxy-containing compound; a hybrid compound carrying at least one isocyanate group and, at the same time, at least one radically polymerizable group; a latent curing agent based on nitrogen compounds suitable for crosslinking the epoxy-containing compound by addition reaction; a photoinitiator capable of forming radicals when irradiated with light, and optionally other additives. The mass is characterized in that it is surface dry after light curing by means of radical photopolymerization.
                            本发明涉及一种双重固化的无溶剂单组分质量,用于粘合、成型、密封和涂覆基材,特别是电子元件。该质量包括至少具有双官能团的含环氧化合物;一种混合物,带有至少一个
异氰酸酯基团,同时带有至少一个自由基聚合基团;一种基于氮化合物的潜在固化剂,适用于通过加成反应交联环氧化合物;一种光
引发剂,能够在光照射时形成自由基,以及可选的其他添加剂。该质量的特点在于,通过自由基光聚合的光固化后表面干燥。