申请人:Dow Corning Asia, Ltd.
公开号:US05789460A1
公开(公告)日:1998-08-04
Curable compositions comprising a substance that produces a base when exposed to radiation and a polymer molecule that contains silicon-hydrogen bonds which react with hydroxyl groups under the action of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules. These compositions cure when exposed to radiation. A pattern can be formed by placing a mask between a coating of the composition and the radiation source during this exposure episode and thereafter dissolving the uncured composition. The compositions have little weight loss during their cure, they can be cured by low intensity radiation, and they yield heat-resistant cured products.
可治愈组合物包括一种物质,在暴露于辐射时产生碱性物质,以及一种聚合物分子,其中包含硅氢键,这些键在碱性物质的作用下与羟基反应,形成硅氧键(Si-O)和氢分子。这些组合物在暴露于辐射时会固化。在这种暴露过程中,在组合物的涂层和辐射源之间放置掩膜,可以形成图案,然后溶解未固化的组合物。这些组合物在固化过程中重量损失很小,可以通过低强度辐射固化,并产生耐热的固化产品。