POSITIVE RESIST COMPOSITION, PATTERN FORMING METHOD USING THE COMPOSITION, AND COMPOUND FOR USE IN THE COMPOSITION
申请人:Takahashi Hidenori
公开号:US20110183258A1
公开(公告)日:2011-07-28
A positive resist composition comprising (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (B) a resin capable of increasing the solubility in an alkali developer by the action of an acid, and (C) a compound having a specific structure, which decomposes by the action of an acid to generate an acid, a pattern forming method using the positive resist composition, and a compound for use in the positive resist composition are provided as a positive resist composition exhibiting good performance in terms of pattern profile, line edge roughness, pattern collapse, sensitivity and resolution in normal exposure (dry exposure), immersion exposure and double exposure, a pattern forming method using the positive resist composition and a compound for use in the positive resist composition.
本发明提供了一种正性光阻组合物,包括(A)一种在与光致发色剂或辐射照射时能够产生酸的化合物,(B)一种树脂,能够通过酸的作用增加在碱性显影剂中的溶解度,以及(C)一种具有特定结构的化合物,能够通过酸的作用分解产生酸。该正性光阻组合物在正常曝光(干曝光)、浸没曝光和双重曝光中表现出良好的图案形貌、线边粗糙度、图案坍塌、灵敏度和分辨率性能。同时,本发明提供了一种使用该正性光阻组合物的图案形成方法以及用于该正性光阻组合物的化合物。