A new thermosetting resin composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of smaller than 650 but not smaller than 450 and a ratio of the weight average molecular weight thereof to the number average molecular weight thereof of in the range of 1.3-3.0; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula:
wherein X is -CR₁R₂-, -CO-, -COO-, -SO₂-, -SO-, -S-, -O-, -NR₁-, -SiR₁R₂- or -POR₁- where R₁ and R₂ each stands for hydrogen, a lower alkyl or a phenyl; Y and Y′ each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.
本发明公开了一种新的热固性
树脂组合物,它包括一种双
酚 A 型环
氧树脂,其平均分子量小于 650 但不小于 450,且其重量平均分子量与平均分子量之比范围在 1.3-3.0 之间;以及一种能够使环
氧树脂交联的固化剂。固化剂最好是由以下通式表示的化合物:
其中 X 是-CR₁R₂-、-CO-、-COO-、-SO₂-、-SO-、-S-、-O-、-NR₁-、-SiR₁R₂- 或-POR₁- 其中 R₁ 和 R₂ 各自代表
氢、低级烷基或
苯基;Y和Y′分别代表
氢、低级烷基或引电子基团;R是低级烷基;m和n分别是1-4的整数,或它们与
伯胺、
酚类化合物或酸酐的混合物。