The present invention is a material for forming an organic film, containing: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, where W
1
represents a tetravalent organic group, n1 represents an integer of 0 or 1, n2 represents an integer of 1 to 3, and R
1
represents any one or more of the following general formulae (1B). This provides an imide compound, where the compound is cured not only under air, but also under film formation conditions of inert gas, and can form an organic underlayer film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film formation and adhesion to a substrate, and a material for forming an organic film containing the compound.
本发明涉及一种用于形成有机薄膜的材料,包含:(A)用下列一般式(1A)表示的用于形成有机薄膜的化合物;以及(B)有机溶剂,其中W1表示四价有机基团,n1表示0或1的整数,n2表示1至3的整数,R1表示以下一般式(1B)中的任意一个或多个。这提供了一种
酰亚胺化合物,该化合物不仅在空气下固化,而且在惰性气体的薄膜形成条件下也可以固化,并且可以形成具有优异的耐热性、填平和平整化衬底上形成的图案的性能以及对衬底的良好成膜性和附着性的有机底层薄膜,以及含有该化合物的用于形成有机薄膜的材料。