MATERIAL FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20210181637A1
公开(公告)日:2021-06-17
The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent, where X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 1 to 10, and R
1
represents at least one or more of the following general formulae (2) to (4). This aims to provide an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate.
MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20220107566A1
公开(公告)日:2022-04-07
The present invention is a material for forming an organic film, containing: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, where W
1
represents a tetravalent organic group, n1 represents an integer of 0 or 1, n2 represents an integer of 1 to 3, and R
1
represents any one or more of the following general formulae (1B). This provides an imide compound, where the compound is cured not only under air, but also under film formation conditions of inert gas, and can form an organic underlayer film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film formation and adhesion to a substrate, and a material for forming an organic film containing the compound.
COMPOSITION, FILM, AND PRODUCTION METHOD OF PATTERNED SUBSTRATE
申请人:JSR CORPORATION
公开号:US20200348595A1
公开(公告)日:2020-11-05
A composition contains: a compound including at least one group selected from the group consisting of a group represented by formula (1-1), a group represented by formula (1-2), and a group represented by formula (1-3); and a solvent. In formulae (1-1) to (1-3), * and ** each denote a site bonding to a part other than the group represented by the formulae (1-1) to (1-3) in the compound; and a and b are each independently an integer of 0 to 3. In a case in which a is 0, b is no less than 1, and in a case in which a is no less than 1, b is 0.