申请人:Imakuni Akira
公开号:US20100240908A1
公开(公告)日:2010-09-23
The invention provides an acetylene compound represented by the following Formula (1), which is useful as a raw material for a polymer achieving high thermal resistance;
wherein, in Formula (1), the encircled Ar represents an aryl group or a heteroaryl group; X represents a divalent linking group; R, R′ and R
1
each independently represent a hydrogen atom, a hydrocarbon group or a heterocyclic group; R
2
represents a hydrogen atom or a substituent substitutable on a benzene ring; A represents a hydrocarbon group or a heterocyclic group; Q represents a hydrogen atom, a hydrocarbon group, or a metal element capable of forming a monovalent metal salt; a represents an integer from 0 or more; b, m and n each independently represent an integer of 1 or more; when n, m and b are 1 at the same time, X is not —(C═O)O—; and when n is 2, and both m and b are 1, X is not —O—.