EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME
申请人:Mitsubishi Chemical Corporation
公开号:EP4023694A1
公开(公告)日:2022-07-06
Provided is a polyorganosiloxane with an epoxy group, a curable resin composition, and a cured product with high compatibility with an initiator and another resin, low viscosity, a high curing rate, and high adhesiveness and impact resistance. A polyorganosiloxane with an epoxy group comprising an M unit (R1R2R3SiO1/2), a D unit (R4R5O2/2), and a Q unit (SiO4/2), a T unit (R6SiO3/2) content being 80% or less by mole of total silicon. The epoxy group has a group represented by the following formula (2) and a group represented by the following formula (3). In the formula (2), R8 denotes an optionally substituted divalent organic group having 1 to 20 carbon atoms. g is 0 or 1. In the formula (3), R9 denotes an optionally substituted divalent organic group having 1 to 20 carbon atoms. h is 0 or 1, 0 ≤ i ≤ 8, and 0 < j ≤ 8.
本发明提供了一种带有环氧基团的聚有机硅氧烷、一种可固化树脂组合物,以及一种与引发剂和另一种树脂具有高兼容性、低粘度、高固化速率、高粘合性和抗冲击性的固化产品。一种具有环氧基团的聚有机硅氧烷,环氧基团包括一个 M 单元(R1R2R3SiO1/2)、一个 D 单元(R4R5O2/2)和一个 Q 单元(SiO4/2),T 单元(R6SiO3/2)的含量为总硅摩尔的 80% 或更少。环氧基团有下式(2)表示的基团和下式(3)表示的基团。在式(2)中,R8 表示具有 1 至 20 个碳原子的任选取代的二价有机基团,g 为 0 或 1。h为0或1,0≤i≤8,且0<j≤8。