This invention relates to: a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability; a novel aromatic diamino compound used for preparing the polyimide; a preparation process thereof; a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement; a process for preparing the resin composition; and an injection molded article of the resin composition.
The polyimide comprises a requisite structural unit having one or more recurring structural units of the formula:
wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is
, and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.
The polyimide or polyimide copolymer is outstanding in melt-flow stability, and has greatly improved processability and excellent heat resistance. Consequently, the polyimide or polyimide copolymer can be applied to structural materials, and electric · electronic appliances.
本发明涉及:一种新型聚
酰亚胺或聚
酰亚胺共聚物,具有优异的耐热性,并大大提高了加工性能;一种用于制备该聚
酰亚胺的新型芳香族二
氨基化合物;其制备工艺;一种聚
酰亚胺基
树脂组合物,包括该聚
酰亚胺或聚
酰亚胺共聚物和纤维增强材料;一种制备该
树脂组合物的工艺;以及一种由该
树脂组合物制成的注塑制品。
聚
酰亚胺包括具有一个或多个式中重复结构单元的必要结构单元:
其中 L 是氧原子、羰基、亚异丙基或六
氟亚异丙基,X 是
Ar 是具有 6 至 27 个碳原子的四价基,选自由单芳香基、缩合多芳香基和非缩合多 芳香基组成的组,这些芳香基之间通过直接键或桥件连接。
这种聚
酰亚胺或聚
酰亚胺共聚物具有出色的熔体流动稳定性,并大大提高了加工性能和优异的耐热性。因此,聚
酰亚胺或聚
酰亚胺共聚物可用于结构材料和电子电气设备。