3,4-diiodo-aniline | 42016-95-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,4-diiodo-aniline
• 英文别名: 3,4-Dijod-anilin；3,4-diiodo-benzenamine；3,4-Diiodoaniline
• CAS: 42016-95-5
• 化学式: C₆H₅I₂N
• 分子量: 344.921
• InChiKey: GHWMYAKHPIIZNH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  9
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  26
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  3,4-diiodo-aniline 在 亚硝酸丁酯 、 硫酸 、 potassium carbonate 、 溶剂黄146 、 丙酮 作用下， 生成 2-(3,4-diiodo-phenoxy)-butyric acid
  参考文献：
  名称：

  Röntgenkontrastmittel auf der Basis jodierter Phenoxyfettsäuren

  摘要：

  Die Darstellung mono-, di-, tri- und tetrajodierter Phenoxyfettsäuren durch Kondensation jodierter Phenole mit geeigneten Halogenfettsäureestern oder durch Jodieren von Phenoxyfettsäuren mit JCL wird beschrieben。Bessere Herstellungsmethoden bekannter Jodphenole und die Synthesen einiger di-, tri- und tetrajodierter Phenole werden angegeben。Zwei Versuche zur Gewinnung der Tetrajod-m-aminobenzoesäure

  DOI：

  10.1002/ardp.19592921102
• 作为产物：
  描述：

  1,2-二碘-4-硝基苯 在 盐酸 、 tin(ll) chloride 作用下， 生成 3,4-diiodo-aniline
  参考文献：
  名称：

  Brenans, Bulletin de la Societe Chimique de France, 1903, vol. <3> 29, p. 603

  摘要：

  DOI：

文献信息

• Novel dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith
  申请人：——

  公开号：US20010009293A1

  公开（公告）日：2001-07-26

  A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.

  提供了一种新颖的介电材料组合物，可用于集成电路器件和集成电路封装器件的制造。该介电组合物是通过咪唑化和固化寡聚物前体化合物制备的，该前体化合物包括一个中央的聚苯并咪唑、聚苯并噻唑、聚酰胺酸或聚酰胺酸酯段，在每个末端以含有芳基取代的乙炔基团为端基，例如，3,4-双(苯基乙炔基)苯。同时提供了集成电路器件、集成电路封装器件的制造方法和合成方法。
• Process for forming an integrated circuit
  申请人：——

  公开号：US20010009296A1

  公开（公告）日：2001-07-26

  A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.

  提供了一种新型介电材料组合物，可用于制造集成电路器件和集成电路封装器件。该介电组合物通过咪唑化和固化寡聚前体化合物制备，该前体化合物由中央聚苯并咪唑、聚苯并噻唑、聚酰胺酸或聚酰胺酸酯段组成，每个末端以含有芳基取代的乙炔基团进行端基修饰，例如3,4-双(苯基乙炔基)苯。还提供了集成电路器件、集成电路封装器件以及合成和制造方法。
• Interconnect dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith
  申请人：International Business Machines Corporation

  公开号：US06265753B1

  公开（公告）日：2001-07-24

  A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybezothiazole polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynly)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.

  提供了一种新型介电材料组合物，可用于集成电路器件和集成电路封装器件的制造。该介电组合物是通过咪唑化和固化寡聚体前体化合物制备而成的，该化合物由中央聚苯并噁嗪、聚苯并噻唑、聚酰亚胺酸酯段组成，每个末端都带有芳基取代乙炔基团，例如邻-双(芳基乙炔基)芳基基团，例如3,4-双(苯基乙炔基)苯基。同时提供了集成电路器件、集成电路封装器件的制造方法和合成方法。
• Dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith
  申请人：International Business Machines Corporation

  公开号：US06518392B2

  公开（公告）日：2003-02-11

  A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.

  提供了一种新的介电复合材料，可用于制造集成电路器件和集成电路封装器件。该介电复合材料通过对寡聚体前体化合物进行咪唑化和固化制备而成，该前体化合物由中央聚苯并咪唑，聚苯并噻唑，聚酰胺酸或聚酰胺酸酯段组成，每个末端都带有芳基取代的乙炔基团，例如邻-双(芳基乙炔基)芳基团，例如3,4-双(苯基乙炔基)苯基团。同时提供了集成电路器件、集成电路封装器件的制造方法和合成方法。
• Polymer compound formed by condensing polyacrylic acid, polyamine and aromatic monoamine, intermediate composition, negative electrode, electrical storage device, slurry for negative electrode, method for producing polymer compound, and method for producing negative electrode
  申请人：KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

  公开号：US10351672B2

  公开（公告）日：2019-07-16

  A polymer compound is formed by condensing a polyacrylic acid, a polyfunctional amine represented by the following general formula (1), and an aromatic monoamine. A chain structure constituted by the polyacrylic acid has free carboxyl groups and carboxyl groups to which the aromatic monoamines are bonded. Y is a straight-chain alkyl group having 1 to 4 carbon atoms, a phenylene group, or an oxygen atom. R1 and R2 are each independently one or more hydrogen atoms, a methyl group, an ethyl group, a trifluoromethyl group, or a methoxy group.

  一种聚合物化合物是由聚丙烯酸、以下通式（1）表示的多官能胺和芳香族单胺缩合而成。由聚丙烯酸构成的链结构具有自由羧基和芳香族单胺所键合的羧基。 Y 是具有 1 至 4 个碳原子的直链烷基、亚苯基或氧原子。R1 和 R2 各自独立地为一个或多个氢原子、甲基、乙基、三氟甲基或甲氧基。