申请人:Rohm and Haas Electronic Materials LLC
公开号:US10754249B2
公开(公告)日:2020-08-25
In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.
在第一方面,提供的方法包括:(a) 在基底上涂敷可固化组合物;(b) 在可固化组合物上方涂敷硬掩膜组合物;(c) 在硬掩膜组合物上方涂敷光阻组合物层,其中一种或多种组合物在无灰工艺中去除。第二方面,提供的方法包括:(a) 在基底上涂敷有机组合物;(b) 在有机组合物上方涂敷光阻组合物层,其中有机组合物包括在热处理和/或辐射处理后产生碱溶性基团的材料。还提供了相关的组合物。