2-sec-Butyl-phenylacetat | 3056-61-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚酯
• 英文名称: 2-sec-Butyl-phenylacetat
• 英文别名: 2-(1-Methylpropyl)phenyl acetate；(2-butan-2-ylphenyl) acetate
• CAS: 3056-61-9
• 化学式: C₁₂H₁₆O₂
• 分子量: 192.258
• InChiKey: WZBSXXFUIDAFCO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  14
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.42
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  2-仲丁基苯酚 、 乙酸酐 在 三乙胺 作用下， 生成 2-sec-Butyl-phenylacetat
  参考文献：
  名称：

  碘化三苯基磷碘化环己二烯酮的去甲基芳构化

  摘要：

  开发了使用碘化三苯基磷碘化物对环己二烯酮进行高效且无金属的去甲基化和伴随的芳构化。多种甾体和非甾体底物顺利进行去甲基芳构化反应，以良好的收率生成相应的酚类产物。这种方法表现出广泛的功能组耐受性。提出了协同作用的离子机制。该方法在 1,4-androstadiene-3,17-dione 一步转化为 3-hydroxy-1,3,5(10)-estratrien-17-one 过程中显示出潜在的工业价值一系列甾体避孕药。

  DOI：

  10.1016/j.tetlet.2023.154365

文献信息

• Novel Selenazolidine and Thiazolidine Compounds for Treating Cancer and Other Diseases
  申请人：The Penn State Research Foundation

  公开号：US20170260151A1

  公开（公告）日：2017-09-14

  The present invention includes compounds useful in preventing or treating cancer in a subject in need thereof. The present invention also includes methods of preventing or treating cancer in a subject in need thereof by administering to the subject a therapeutically effective amount of a compound of the invention.

  本发明涵盖了对需要预防或治疗癌症的受试者有用的化合物。本发明还包括通过向受试者投予本发明中的化合物的治疗有效量来预防或治疗需要的受试者的癌症的方法。
• TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
  申请人：FUJIFILM Corporation

  公开号：US20150184032A1

  公开（公告）日：2015-07-02

  By a temporary adhesive for production of semiconductor device containing (A) a polymer compound having a thermal decomposition initiation temperature of 250° C. or more, and (B) a radical polymerizable monomer, and an adhesive support and a production method of semiconductor device using the same, a temporary adhesive for production of semiconductor device, which can temporarily support a member to be processed (for example, a semiconductor wafer) with a high adhesive force even under high temperature condition (for example, at 100° C.) when the member to be processed is subjected to a mechanical or chemical processing, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition, and which can easily release the temporary support for the member processed without imparting damage to the member processed, and an adhesive support and a production method of semiconductor device using the same can be provided.