COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM, AND CONNECTION STRUCTURE USING THE SAME
申请人:SAMSUNG SDI CO., LTD.
公开号:US20170162531A1
公开(公告)日:2017-06-08
An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1:
Heat quantity variation rate (%)=[(
H
0
−H
1
)/
H
0
]×100 Equation 1
wherein H
0
is a DSC heat quantity of the anisotropic conductive film, as measured at 25° C. and a time point of 0 hr, and H
1
is a DSC heat quantity of the anisotropic conductive film, as measured after being left at 40° C. for 24 hours.