4-allyl-1-isopropoxy-2-methoxy-benzene | 84019-90-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: 4-allyl-1-isopropoxy-2-methoxy-benzene
• 英文别名: 4-Allyl-1-isopropoxy-2-methoxy-benzol；O-Isopropyl-eugenol；Eugenolisopropylaether；3-Methoxy-4-isopropyloxy-1-allyl-benzol；Isopropyleugenol；2-methoxy-1-propan-2-yloxy-4-prop-2-enylbenzene
• CAS: 84019-90-9
• 化学式: C₁₃H₁₈O₂
• 分子量: 206.285
• InChiKey: DZNZJOUTMIJWRW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  15
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.38
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• [EN] REACTIVE TYPE PHOSPHATE AND PREPARATION PROCESS<br/>[FR] PHOSPHATE DE TYPE RÉACTIF ET PROCÉDÉ DE PRÉPARATION
  申请人：BLUE CUBE IP LLC

  公开号：WO2021237695A1

  公开（公告）日：2021-12-02

  Provided herein are phosphorus-based flame retardant compounds that provide both good electrical characteristics and good heat resistance characteristics when incorporated into PCB compositions. In particular, provided herein are new organophosphorus-based polymers that contain C=C double bonds, which allows them react with other components (for example, C=C bond capped polyphenyl ether, unsaturated hydrocarbon resin, bismaleic imide, etc. ) to form a crosslinked network.

  本文提供了一些基于磷的阻燃化合物，当它们被加入到PCB组成中时，可以同时提供良好的电特性和热阻特性。特别地，本文提供了一些含有C=C双键的新型有机磷聚合物，这使它们能够与其他组分（例如，C=C键封端的聚苯醚、不饱和烃树脂、双马来酰亚胺等）反应，形成交联网络。
• VERFAHREN ZUR HERSTELLUNG VON HYDROSILYLIERBAREN EUGENOL-POLYETHERN UND EUGENOL-POLYETHERSILOXANEN SOWIE DEREN VERWENDUNG
  申请人：Evonik Degussa GmbH

  公开号：EP3189093B1

  公开（公告）日：2019-10-02
• [EN] HALOGEN FREE VERY LOW LOSS RESIN COMPOSITION<br/>[FR] COMPOSITION DE RÉSINE À TRÈS FAIBLE PERTE SANS HALOGÈNE
  申请人：BLUE CUBE IP LLC

  公开号：WO2021237696A1

  公开（公告）日：2021-12-02

  Provided herein are halogen-free, flame retardant curable resin compositions that provide both good electrical characteristics and good heat resistance characteristics sufficient to allow for their use in high-performance PCB systems. In particular, provided herein are new organophosphorus olefins that are useful as reactive-time flame retardants. Surprisingly, it has been discovered that these reactive-type compounds provide good dielectric performance and heat resistance when incorporated into PCB compositions. The presence of C=C double bonds in these organophosphorus olefins allows them to react with unsaturated resins (for example, C=C double capped polyphenyl ether, bismaleic imide, etc. ) to form a crosslinked network.