3-hydroxy-2,5,6-trimethyl-4-pyrone | 131524-05-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡喃
• 英文名称: 3-hydroxy-2,5,6-trimethyl-4-pyrone
• 英文别名: 3-Hydroxy-2,5,6-trimethylpyran-4-one
• CAS: 131524-05-5
• 化学式: C₈H₁₀O₃
• 分子量: 154.166
• InChiKey: COIRLVVFOYBHOP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.1
• 重原子数：
  11
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.38
• 拓扑面积：
  46.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  6-methoxy-5,6-dimethylpyran-3-one 在 sodium hydroxide 、 硫酸 、 双氧水 作用下， 生成 3-hydroxy-2,5,6-trimethyl-4-pyrone
  参考文献：
  名称：

  Arnarp, Jan; Bielawski, Jacek; Dahlin, Britt-Marie, Acta Chemica Scandinavica, 1990, vol. 44, # 7, p. 916 - 926

  摘要：

  DOI：

文献信息

• FLUORINATED DERIVATES OF 3-HYDROXYPYRIDIN-4-ONES
  申请人：Tam Tim Fat

  公开号：US20120270882A1

  公开（公告）日：2012-10-25

  Provided are compounds of Formula I which are derivatives of 3-Hydroxypyridin-4-ones. The compounds may be used in treatment of a medical condition related to a toxic concentration of iron. The compounds may be used for preparation of a medicament for treatment of a medical condition related to a toxic concentration of iron. The medical condition related to a toxic concentration of iron may be selected from the group consisting of: cancer, pulmonary disease, progressive kidney disease and Frederich's Ataxia.

  提供的是公式I的化合物，它们是3-羟基吡啶-4-酮的衍生物。这些化合物可以用于治疗与铁的毒性浓度相关的医疗状况。这些化合物可以用于制备治疗与铁的毒性浓度相关的医疗状况的药物。与铁的毒性浓度相关的医疗状况可以从以下组中选择：癌症、肺部疾病、进行性肾脏疾病和弗里德里希共济失调症。
• FLUORINATED DERIVATIVES OF 3-HYDROXYPYRIDIN-4-ONES
  申请人：APOTEX TECHNOLOGIES INC.

  公开号：US20150335626A1

  公开（公告）日：2015-11-26

  Provided are compounds of Formula I which are derivatives of 3-Hydroxypyridin-4-ones. The compounds may be used in treatment of a medical condition related to a toxic concentration of iron. The compounds may be used for preparation of a medicament for treatment of a medical condition related to a toxic concentration of iron. The medical condition related to a toxic concentration of iron may be selected from the group consisting of: cancer, pulmonary disease, progressive kidney disease and Frederich's Ataxia.

  提供的是I式化合物，它们是3-羟基吡啶-4-酮的衍生物。这些化合物可用于治疗与铁的毒性浓度相关的医疗状况。这些化合物可用于制备治疗与铁的毒性浓度相关的医疗状况的药物。与铁的毒性浓度相关的医疗状况可从以下组中选择：癌症，肺部疾病，进行性肾脏疾病和弗里德里希共济失调症。
• Fluorinated Derivatives of 3-Hydroxypyridin-4-Ones
  申请人：Apotex Technologies Inc.

  公开号：US20160083346A1

  公开（公告）日：2016-03-24

  Compounds of Formula I which are derivatives of 3-Hydroxypyridin-4-ones. The compounds may be used in treatment of a medical condition related to a toxic concentration of iron. The compounds may be used for preparation of a medicament for treatment of a medical condition related to a toxic concentration of iron. The medical condition related to a toxic concentration of iron may be selected from the group consisting of: cancer, pulmonary disease, progressive kidney disease and Friedreich's ataxia.

  公式I的衍生物化合物是3-羟基吡啶-4-酮的衍生物。这些化合物可用于治疗与铁的毒性浓度相关的医疗状况。这些化合物可用于制备治疗与铁的毒性浓度相关的医疗状况的药物。与铁毒性浓度相关的医疗状况可以从以下组中选择：癌症、肺病、进行性肾病和弗里德赫氏共济失调。
• POLISHING SOLUTION FOR CMP AND POLISHING METHOD USING THE POLISHING SOLUTION
  申请人：Satou Eiichi

  公开号：US20110275217A1

  公开（公告）日：2011-11-10

  The polishing solution for CMP of the invention comprises abrasive grains, a first additive and water, wherein the first additive is at least 1,2-benzoisothiazole-3(2H)-one or 2-aminothiazole. The polishing method of the invention is a polishing method for a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad.
• POLISHING LIQUID FOR CMP AND POLISHING METHOD USING THE SAME
  申请人：Hanano Masayuki

  公开号：US20120315763A1

  公开（公告）日：2012-12-13

  An object of the present invention is to provide a polishing liquid for CMP with which polishing scratches can be reduced and a sufficiently high polishing rate can be obtained in a CMP step for an ILD film, aggregation of an abrasive grain is difficult to occur, and high flatness is obtained, and provide a polishing method using the same. The polishing liquid for CMP according to the present invention is a polishing liquid for CMP containing an abrasive grain, an additive, and water, wherein the abrasive grain comprises a cerium-based particle, and the additive comprises a 4-pyrone-based compound and at least one of a nonionic surfactant or a cationic surfactant: [wherein X 11 , X 12 , and X 13 each independently represent a hydrogen atom or a monovalent substituent.]