1,1'-[Hexane-1,4-diylbis(oxy-4,1-phenylene)]di(1H-pyrrole-2,5-dione) | 147299-73-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 英文名称: 1,1'-[Hexane-1,4-diylbis(oxy-4,1-phenylene)]di(1H-pyrrole-2,5-dione)
• 英文别名: 1-[4-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]hexoxy]phenyl]pyrrole-2,5-dione
• CAS: 147299-73-8
• 化学式: C₂₆H₂₄N₂O₆
• 分子量: 460.5
• InChiKey: BLNMJGMHJHJEAE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.5
• 重原子数：
  34
• 可旋转键数：
  10
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  93.2
• 氢给体数：
  0
• 氢受体数：
  6

文献信息

• Resin composition, prepreg and their uses
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：EP2090612B1

  公开（公告）日：2010-11-10
• RESIN COMPOSITION, PREPREG AND THEIR USES
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：US20140235126A1

  公开（公告）日：2014-08-21

  A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.
• US8748541B2
  申请人：——

  公开号：US8748541B2

  公开（公告）日：2014-06-10
• US9199434B2
  申请人：——

  公开号：US9199434B2

  公开（公告）日：2015-12-01