申请人:Rohm and Haas Electronic Materials LLC
公开号:EP3336124A1
公开(公告)日:2018-06-20
Polyarylene oligomer compositions having improved adhesion to surfaces as compared to conventional polyarylene oligomers are useful in forming dielectric material layers in electronics applications.
与传统的聚芳基烯低聚物相比,聚芳基烯低聚物组合物具有更好的表面附着力,可用于在电子应用中形成介电材料层。