ACRYLIC RUBBER COMPOSITION AND ACRYLIC RUBBER CROSSLINKED PRODUCT
申请人:ZEON CORPORATION
公开号:EP1790689A1
公开(公告)日:2007-05-30
It is to provide an acrylic rubber composition which provides an acrylic rubber vulcanizate retaining high tensile strength and modulus even if a long-termthermal load is applied and contains no component limited by environmental regulations. The above object is attained by an acrylic rubber composition comprising 100 parts by weight of a carboxyl group-containing acrylic rubber and 0.3 to 8 parts by weight of a styrenated diphenylamine compound, and by an acrylic rubber composition further comprising 0.05 to 20 parts by weight of a crosslinking agent besides the above components.
Acrylic Rubber Composition And Acrylic Rubber Vulcanizate
申请人:Ohishi Takeshi
公开号:US20080071014A1
公开(公告)日:2008-03-20
It is to provide an acrylic rubber composition which provides an acrylic rubber vulcanizate retaining high tensile strength and modulus even if a long-term thermal load is applied and contains no component limited by environmental regulations. The above object is attained by an acrylic rubber composition comprising 100 parts by weight of a carboxyl group-containing acrylic rubber and 0.3 to 8 parts by weight of a styrenated diphenylamine compound, and by an acrylic rubber composition further comprising 0.05 to 20 parts by weight of a crosslinking agent besides the above components.
RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE
申请人:Sugasaki Atsushi
公开号:US20090081414A1
公开(公告)日:2009-03-26
A resin composition for laser engraving contains a hydrophilic polymer and a light-to-heat conversion agent having an absorption maximum wavelength in a range of from 700 to 1,300 nm.
Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate
申请人:Sugasaki Atsushi
公开号:US20090220752A1
公开(公告)日:2009-09-03
The invention provides a resin composition for laser engraving, having a binder polymer containing at least one of a structure unit represented by the following Formula (I) or a structure unit represented by the following Formula (II). In the Formulae, Q represents a partial structure which provides an acid group having an acid dissociation constant pKa of 0 to 20 when it is in the form of -Q-H; R
1
to R
3
each independently represent a hydrogen atom or a monovalent organic group; and A and B each independently represent a bivalent organic connecting group. The invention further provides a relief printing plate precursor having a relief forming layer containing the resin composition, a method for manufacturing a relief printing plate having crosslinking components of the relief forming layer and laser engraving the relief forming layer, and a relief printing plate formed thereby.
RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE
申请人:KAWASHIMA Takashi
公开号:US20090246469A1
公开(公告)日:2009-10-01
The invention provides a resin composition for laser engraving, containing at least (A) a polymerizable compound having two or more ethylenic unsaturated bonds, a carbon-sulfur bond being contained at the site where two among the two or more ethylenic unsaturated bonds are connected and (B) a binder polymer. The invention further provides an image forming material containing the resin composition, a relief printing plate precursor having a relief forming layer which contains the resin composition, a relief printing plate precursor having a relief forming layer which contains a product formed by subjecting the resin composition to cross-linking, a method for manufacturing a relief printing plate including subjecting the relief printing plate precursor having the relief forming layer which contains the resin composition to cross-linking, and a relief printing plate manufactured by the manufacturing method.