申请人:President and Fellows of Harvard College
公开号:EP2182088A1
公开(公告)日:2010-05-05
Metal films are deposited with uniform thickness and excellent step coverage. Copper metal films were deposited on heated substrates by the reaction of alternating doses of copper(I) NN'-diisopropylacetamidinate vapor and hydrogen gas. Cobalt metal films were deposited on heated substrates by the reaction of alternating doses of cobalt(II) bis(N,N'-diisopropylacetamidinate) vapor and hydrogen gas. Nitrides and oxides of these metals can be formed by replacing the hydrogen with ammonia or water vapor, respectively. The films have very uniform thickness and excellent step coverage in narrow holes. Suitable applications include electrical interconnects in microelectronics and magnetoresistant layers in magnetic information storage devices.
沉积的金属膜厚度均匀,阶跃覆盖性极佳。铜金属膜是通过交替使用 NN'-二异丙基乙酰胺铜(I)蒸气和氢气反应沉积在加热的基底上的。通过交替使用双(N,N'-二异丙基乙酰胺基)钴(II)蒸气和氢气,在加热的基底上沉积出金属钴膜。用氨气或水蒸气代替氢气,可分别形成这些金属的氮化物和氧化物。薄膜的厚度非常均匀,在窄孔中具有良好的阶跃覆盖性。适合的应用包括微电子中的电气互连和磁性信息存储设备中的抗磁层。