申请人:Nippon Soda Co., Ltd.
公开号:EP2489689A1
公开(公告)日:2012-08-22
An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C):
(A) an epoxy resin;
(B) a clathrate compound of a carboxylic acid derivative represented by formula (I):
R(COOH)n (I);
and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).
本发明的目的是提供一种用于形成固化环氧树脂的组合物,其中该组合物可以在低温下抑制固化反应,从而提高单包稳定性,还可以进行加热处理,从而有效地固化树脂。本发明提供了一种用于形成固化环氧树脂的组合物,该组合物包括以下组分(A)、(B)和(C):
(A) 环氧树脂;
(B) 由式(I)代表的羧酸衍生物的凝块化合物:
R(COOH)n (I);
和式 (II) 所代表的咪唑化合物;以及 (C) 式 (III) 所代表的四联酚型化合物。