申请人:FUJIMI INCORPORATED
公开号:US10988637B2
公开(公告)日:2021-04-27
A polishing composition according to the present invention is used to polish an object to be polished including a high dielectric constant layer, in which the polishing composition contains an abrasive grain, water, and organic acid, when a zeta potential of the abrasive grain in the polishing composition is set as X [mV], and a zeta potential of the high dielectric constant layer during polishing using the polishing composition is set as Y [mV], X is positive, and Y−X≤−5 is established.
根据本发明的一种抛光组合物用于抛光包括高介电常数层的待抛光物体,其中抛光组合物包含磨粒、水和有机酸,当抛光组合物中磨粒的 zeta 电位设为 X [mV],使用抛光组合物抛光时高介电常数层的 zeta 电位设为 Y [mV],X 为正,Y-X≤-5 成立。