申请人:Asahi Kasei Kogyo Kabushiki Kaisha
公开号:EP0193068A1
公开(公告)日:1986-09-03
@ The present invention provides a one-liquid type epoxy resin composition which is useful especially as a coating material and adhesive for a wide range of applications. The resin composition comprises
(1) an epoxy resin (A) containing at least an average of two epoxy groups per molecular unit; and
(2) a curing agent (B) consisting essentially of a powdery amine compound (C) having a softening point of 50 to 150°C, the particles of said powdery amine compound being coated with at least one of the following layers:
(i) a layer formed by adhesion to the surface of said particles of at least one compound selected from the group consisting of an isocyanate (D), a carboxylic acid (E), a carboxylic acid anhydride (F), an acid halogenated compound (G) and an epoxy compound (H); and
(ii) a layer formed by covalent bonding of the powdery amine compound (C) with at least one compound selected from the group consisting of an isocyanate (D), a carboxylic acid (E), a carboxylic acid anhydride (F), an acid halogenated compound (G) and an epoxy compound (H);
the softening temperature of said curing agent (B) being 5 to 50°C higher than the softening temperature of said powdery amine compound (C).
本发明提供了一种单液型环氧树脂组合物,该组合物尤其可用作应用广泛的涂层材料和粘合剂。该树脂组合物包括
(1) 环氧树脂(A),平均每个分子单位至少含有两个环氧基团;以及
(2) 固化剂 (B) 主要由粉末状胺化合物 (C) 组成,其软化点为 50 至 150°C,所述粉末状胺化合物的颗粒上至少涂有以下一层:
(i) 至少一种选自异氰酸酯 (D)、羧酸 (E)、羧酸酐 (F)、酸性卤化化合物 (G) 和环氧化合物 (H) 的化合物粘附在所述颗粒表面而形成的层;以及
(ii) 由粉状胺化合物(C)与至少一种选自异氰酸酯(D)、羧酸(E)、羧酸酐 (F)、酸卤化合物(G)和环氧化合物(H)的化合物共价键合而形成的层;
所述固化剂(B)的软化温度比所述粉状胺化合物(C)的软化温度高 5 至 50°C。