申请人:Alps Electric Co., Ltd. and Shiro Koayashi
公开号:US05864050A1
公开(公告)日:1999-01-26
The present invention provides a curable resin compound which is soluble in organic solvents and easy to use, and a method for producing the same. The curable resin compound comprises a structure and crosslinkable groups which end-cap the structure, the structure comprising three or four non-substituted benzene rings each of which is joined with each adjacent benzene ring by an ether or ketone linkage so that both types of linkages are present in the structure. Though the curable resin compound exhibits satisfactory solubilities in organic solvents, a composition comprising the compound can be cured by a crosslinking reaction to be insoluble in the organic solvents while being provided with improved solvent resistance and chemical resistance. Accordingly, the present invention also provides a cured-resin material derived from the aforementioned curable resin compound, the cured-resin material being excellent in solvent resistance, chemical resistance and thermal resistance.
本发明提供了一种可溶于有机溶剂且易于使用的可固化树脂化合物及其制备方法。该可固化树脂化合物包括一个结构和端部封顶该结构的可交联基团,该结构由三个或四个未取代苯环组成,每个苯环均通过醚或酮键连接到相邻的苯环,因此该结构中同时存在这两种类型的键。虽然该可固化树脂化合物在有机溶剂中表现出令人满意的溶解度,但包含该化合物的组合物可以通过交联反应固化为在有机溶剂中不溶解,同时具有改善的耐溶剂性和化学性。因此,本发明还提供了由上述可固化树脂化合物制得的固化树脂材料,该固化树脂材料具有优异的耐溶剂性、化学性和热性能。