A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.
一种生产高度稳定的包装基板的方法,其中提供了具有第一骨架和第一
乙炔基的第一前体和具有第二骨架和第二
乙炔基的第二前体。此外,还提供了具有第一和第二反应基团的
交联剂。将第一前体、第二前体、
交联剂和溶剂涂布在表面上形成电绝缘层。第一
乙炔基与第一反应基团在第一碳-碳键形成反应中反应,第二
乙炔基与第二反应基团在第二碳-碳键形成反应中反应,将第一骨架与第二骨架交联,从而形成包装基板。然后去除溶剂。