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Silbercaprylat | 24927-67-1

中文名称
——
中文别名
——
英文名称
Silbercaprylat
英文别名
octanoic acid;silver
Silbercaprylat化学式
CAS
24927-67-1
化学式
C8H16AgO2
mdl
——
分子量
252.08
InChiKey
PBAOIXMPVKPUKB-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 熔点:
    251.26 °C
  • 密度:
    1.56 g/cm3

计算性质

  • 辛醇/水分配系数(LogP):
    2.43
  • 重原子数:
    11
  • 可旋转键数:
    6
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.88
  • 拓扑面积:
    37.3
  • 氢给体数:
    1
  • 氢受体数:
    2

安全信息

  • 海关编码:
    2915900090

SDS

SDS:bbab12849d9d2dddcb89750ba7717908
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文献信息

  • Organic silver complex compound used in paste for conductive pattern forming
    申请人:Yoon Sung-Ho
    公开号:US20100021704A1
    公开(公告)日:2010-01-28
    Disclosed is an organic silver complex compound in which an organic ligand, containing an amine group (—NH 2 ) and a hydroxyl group (—OH), is bonded with aliphatic silver (Ag) carboxylate at an equivalent ratio of 2:1 to form a complex. Also disclosed is a conductive paste comprising: a silver source selected from the group consisting of silver oxide powder, silver powder and silver flake; and organic silver complex compound in which an organic ligand, containing an amine group and a hydroxyl group, is bonded with an organic silver compound to form a complex. The organic silver complex compound has high solubility in a solvent and is present in the liquid state at room temperature. Thus, an extra solvent is not used in a conductive pattern-forming paste containing the complex compound or is used in a small amount, such that the content of silver in the conductive pattern-forming paste can be increased. Also, the conductive pattern-forming paste containing the complex compound has high viscosity, and thus shows excellent stability without adding a dispersant and, at the same time, is easily industrially applied.
    本发明揭示了一种有机银配合物化合物,其中含有氨基(—NH2)和羟基(—OH)的有机配体与脂肪族银(Ag)羧酸盐以2:1的当量比结合形成配合物。还揭示了一种导电浆料,包括:从银氧化物粉末、银粉末和银箔中选择的银源;以及含有氨基和羟基的有机配体与有机银化合物结合形成配合物的有机银配合物化合物。有机银配合物化合物在溶剂中具有高溶解度,并在室温下呈液态。因此,在含有配合物的导电图案形成浆料中不需要额外的溶剂,或者只使用少量溶剂,从而可以增加导电图案形成浆料中银的含量。此外,含有配合物的导电图案形成浆料具有高粘度,因此在不添加分散剂的情况下表现出优异的稳定性,并且易于工业应用。
  • Sulfonium salt compound
    申请人:——
    公开号:US20040033434A1
    公开(公告)日:2004-02-19
    A compound shown by the general formula [1] 1 (wherein R 1 , R 2 and R 3 are each independently an aromatic hydrocarbon residual group, Y n− is an anion derived from a carboxylic acid having 3 or more carbon atoms with substituted fluorine atoms, and n is 1 or 2, provided that R 1 , R 2 and R 3 each is not a phenyl group having substituents at an ortho and/or a meta position), and a composition consisting of the compound and a diazodisulfone compound are disclosed. Use of the compound or the compound as an acid generator for resists produces the effects of improving the profiles of ultra-fine patterns or diminishing sidewall irregularities in ultra-fine patterns. The compound is also useful as a cationic photopolymerization initiator.
    公式为[1]1的化合物被展示出来(其中R1、R2和R3各自独立地是芳香族碳氢残基,Yn−是源自具有3个或更多碳原子的羧酸的阴离子,其中含有取代的氟原子,n为1或2,前提是R1、R2和R3各自不是具有取代基的苯基,该取代基位于邻位和/或间位),并且由该化合物和一种二硫酰二氮化合物组成的组合物被公开。使用该化合物或该化合物作为酸发生剂用于光刻胶会产生改善超细图案轮廓或减少超细图案侧壁不规则性的效果。该化合物还可用作阳离子光聚合引发剂。
  • Heat stable acrylamide polysiloxane composition
    申请人:DOW CORNING CORPORATION
    公开号:EP0518142A1
    公开(公告)日:1992-12-16
    The heat stability of acrylamide functional polydiorganosiloxanes which cure by exposure to ultraviolet radiation can be improved by the addition of nickel carboxylate, stannous naphthenate, cerium carboxylate, manganese carboxylate, aluminum carboxylate, silver carboxylate, copper undecylenate, cobalt carboxylate, mono(methacrylate) tripropoxyzirconate, mono(ethylacetoacetonate) aluminum di(sec-butoxide), di(ethylacetoacetonate) aluminum sec-butoxide, zinc acetylacetonate, molybdenum acetylacetonate and dibutyltin dicarboxylate.
    羧酸铜、十一烯酸铜、羧酸钴、三丙氧基锆酸单(甲基丙烯酸酯)、二(仲丁醇)乙酰丙酮铝、二(仲丁醇)乙酰丙酮铝、乙酰丙酮锌、乙酰丙酮钼和二羧酸二丁基锡。
  • Process for producing photochromic titanium oxide compounds
    申请人:SUMITOMO CHEMICAL COMPANY LIMITED
    公开号:EP0624553A1
    公开(公告)日:1994-11-17
    Disclosed are a process for producing a photochromic titanium oxide compound, which comprises (i) dissolving at least one organotitanium compound and at least one organic compound containing at least one metal selected from the group consisting of sodium, iron, chromium, copper, nickel, vanadium, manganese, silicon, zinc, aluminum, cerium, cobalt, niobium, zirconium, molybdenum and silver in an organic solvent to form a homogeneous solution, and if desired, partially removing said organic solvent, (ii) substantially simultaneously hydrolyzing the organotitanium compound and the metal-containing organic compound in the solution obtained in step (i), (iii) separating the organic solvent from the resultant hydrolysate, and (iv) calcining the hydrolyzate, wherein said steps (ii) and (iii) may be carried out concurrently, as well as a photochromic titanium oxide compound prepared by the process.
    公开了一种生产光致变色氧化钛化合物的工艺,其中包括 (i) 将至少一种有机钛化合物和至少一种含有选自钠、铁、铬、铜、镍、钒、锰、硅、锌、铝、铈、钴、铌、锆、钼和银所组成的组中的至少一种金属的有机化合物溶解在有机溶剂中,形成均匀溶液,如果需要,部分除去所述有机溶剂、 (ii) 基本同时水解步骤(i)中所得溶液中的有机钛化合物和含金属有机化合物、 (iii) 从水解产物中分离出有机溶剂,以及 (iv) 煅烧水解物,其中所述步骤(ii)和(iii)可同时进行,以及通过该工艺制备的光致变色氧化钛化合物。
  • Solder precipitating composition and solder precipitation method
    申请人:Harima Chemicals, Inc.
    公开号:EP1342726A1
    公开(公告)日:2003-09-10
    Lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.
    无铅焊料析出组合物,包括锡粉、银离子和/或铜离子与芳基膦、烷基膦、膦或唑的复合物。析出焊料组合物可以在电路板上形成适当的无铅焊料,而不会在电路板上形成银和/或铜膜。
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