Provided is a method of producing a polyimide resin that produces a polyimide resin excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature. The method of producing a polyimide resin according to the present invention includes heating at from 120°C to 350°C a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent comprising at least a compound (A) represented by the general formula (1), in which R1 represents a hydrogen atom or a hydroxyl group, R2 and R3 independently represent a hydrogen atom or a C1 to C3 alkyl group, and R4 and R5 independently represent a C1 to C3 alkyl group.
本发明提供了一种生产聚
酰亚胺树脂的方法,该方法可生产出耐热性和机械性能优异的聚
酰亚胺树脂,即使在较低温度下进行热处理,其介电常数也很低。根据本发明生产聚
酰亚胺树脂的方法包括在 120°C 至 350°C 的温度下加热由四
羧酸二酐组分和二胺组分在溶剂中反应生成的聚酰胺,该溶剂至少包含通式(1)代表的化合物(A),其中 R1 代表氢原子或羟基,R2 和 R3 独立地代表氢原子或 C1 至 C3 烷基,R4 和 R5 独立地代表 C1 至 C3 烷基。