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Adamantan-2,2-dicarbonsaeure | 33101-09-6

中文名称
——
中文别名
——
英文名称
Adamantan-2,2-dicarbonsaeure
英文别名
Adamantane-2,2-dicarboxylic acid
Adamantan-2,2-dicarbonsaeure化学式
CAS
33101-09-6
化学式
C12H16O4
mdl
——
分子量
224.257
InChiKey
GDVBCOHYGYYFBV-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2.4
  • 重原子数:
    16
  • 可旋转键数:
    2
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.83
  • 拓扑面积:
    74.6
  • 氢给体数:
    2
  • 氢受体数:
    4

文献信息

  • Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device
    申请人:Enoki Takashi
    公开号:US20080206548A1
    公开(公告)日:2008-08-28
    A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.
    一种苯并噁唑树脂前体,包括第一重复单元,该单元由双化合物和二羧酸化合物反应得到,其中至少一个具有金刚烷结构;一种苯并噁唑树脂前体,进一步包括第二重复单元,该单元由不具有金刚烷结构的双化合物和不具有金刚烷结构的二羧酸化合物反应得到;通过上述苯并噁唑树脂前体的环合反应和脱反应得到的聚苯并噁唑树脂;由苯并噁唑树脂前体或聚苯并噁唑树脂构成的树脂膜。可以从苯并噁唑树脂前体中获得具有优异耐热性和小介电常数的聚苯并噁唑树脂树脂膜,以及使用树脂膜的半导体器件。
  • Resin Composition, Varnish, Resin Film and Semiconductor Device
    申请人:Enoki Takashi
    公开号:US20090214860A1
    公开(公告)日:2009-08-27
    Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.
    本发明公开了一种树脂组合物,包括一种苯并噁唑树脂前体,其具有通过反应双化合物和二羧酸化合物得到的第一重复单元,以及交联剂,其中双化合物和/或二羧酸化合物中至少有一个具有金刚烷结构。苯并噁唑树脂前体还包括通过反应不具有金刚烷结构的双化合物和不具有金刚烷结构的二羧酸化合物得到的第二重复单元。此外,本发明还公开了一种包括该树脂组合物的树脂膜。
  • BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE
    申请人:Sumitomo Bakelite Company, Limited
    公开号:EP1832619A1
    公开(公告)日:2007-09-12
    A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.
    一种苯并恶唑树脂前体,包括由双氨基苯酚化合物和二羧酸化合物反应得到的 第一重复单元,其中至少一个重复单元具有菱形结构;苯并恶唑树脂前体,进一步包含第二重复单元,该第二重复单元由无菱形结构的双氨基苯酚化合物和无菱形结构的二羧酸化合物反应得到; 通过上述苯并恶唑树脂前体的脱闭环反应得到的聚苯并恶唑树脂; 由苯并恶唑树脂前体或聚苯并恶唑树脂构成的树脂薄膜。利用苯并恶唑树脂前体可获得具有优异耐热性和较小介电常数的聚苯并恶唑树脂树脂薄膜,以及使用该树脂薄膜的半导体器件。
  • RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE
    申请人:Sumitomo Bakelite Company, Ltd.
    公开号:EP1953181A1
    公开(公告)日:2008-08-06
    Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.
    本发明公开了一种树脂组合物,该树脂组合物包含一种苯并恶唑树脂前体,该前体具有通过双氨基苯酚化合物和二羧酸化合物反应得到的第一重复单元,以及一种交联剂,其中双氨基苯酚化合物和二羧酸化合物中至少有一种具有菱形结构。苯并恶唑树脂前体还包括第二重复单元,该第二重复单元是由不具有菱形结构的双氨基苯酚化合物和不具有菱形结构的二羧酸化合物反应得到的。还公开了一种包含该树脂组合物的树脂薄膜。
  • US8178631B2
    申请人:——
    公开号:US8178631B2
    公开(公告)日:2012-05-15
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