申请人:CHISSO CORPORATION
公开号:EP0601203A1
公开(公告)日:1994-06-15
A photosensitive resin composition wherein the photosensitive group is readily available and easy to introduce, which has good storage stability, thermal stability, practical properties and sensitivity, and which does not undergo cracking in the development stage. The composition comprises 100 parts by weight of a polyimide, 10-100 parts by weight of a (meth)acrylated isocyanurate, 10-100 parts by weight of polyalkylene glycol di(meth)acrylate, and 0.5-20 parts by weight of a photopolymerization initiator. It can provide a patterned, heat-resistant polyimide film. The film is suitable for uses related to electronic materials, for example, an interlaminar film of a multilayered plate of a printed wiring board.
一种光敏树脂组合物,其中的光敏基团易于获得和引入,具有良好的储存稳定性、热稳定性、实用性和灵敏度,并且在显影阶段不会发生裂纹。该组合物包括 100 重量份的聚酰亚胺、10-100 重量份的(甲基)丙烯酸异氰脲酸酯、10-100 重量份的聚亚烷基二醇二(甲基)丙烯酸酯和 0.5-20 重量份的光聚合引发剂。它可以提供一种图案化的耐热聚酰亚胺薄膜。该薄膜适用于与电子材料有关的用途,例如印刷线路板多层板的层间薄膜。