(1r,4r)-4-(4-(oxiran-2-ylmethoxy)phenyl)cyclohexyl 4-(oxiran-2-ylmethoxy)benzoate | 1268813-67-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: (1r,4r)-4-(4-(oxiran-2-ylmethoxy)phenyl)cyclohexyl 4-(oxiran-2-ylmethoxy)benzoate
• 英文别名: trans-4-{4-(2,3-epoxypropoxy)phenyl}cyclohexyl 4-(2,3-epoxypropoxy)benzoate
• CAS: 1268813-67-7
• 化学式: C₂₅H₂₈O₆
• 分子量: 424.494
• InChiKey: XKVHOCFXDVAWIG-OTBLYXKXSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.13
• 重原子数：
  31.0
• 可旋转键数：
  9.0
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.48
• 拓扑面积：
  69.82
• 氢给体数：
  0.0
• 氢受体数：
  6.0

反应信息

• 作为产物：
  描述：

  P-(TRANS-4-HYDROXYCYCLOHEXYL)PHENOL 、 对羟基苯甲酸 在 四丁基溴化铵 、 对甲苯磺酸 作用下， 以 氯苯 为溶剂， 反应 23.0h， 生成 (1r,4r)-4-(4-(oxiran-2-ylmethoxy)phenyl)cyclohexyl 4-(oxiran-2-ylmethoxy)benzoate
  参考文献：
  名称：

  DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND

  摘要：

  公开号：

  EP2474539B1

文献信息

• EPOXY RESIN, EPOXY RESIN COMPOSITION, INORGANIC-FILLER-CONTAINING EPOXY RESIN COMPOSITION, RESIN SHEET, CURED PRODUCT, AND EPOXY COMPOUND
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3239206A1

  公开（公告）日：2017-11-01

  An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

  一种环氧树脂，由具有中原骨架且一个分子中有两个缩水甘油基的环氧树脂单体与一个苯环上有两个羟基作为取代基的二价酚化合物反应而得，其中凝胶渗透色谱法测量的平均分子量为 600 至 2 500。
• RESIN COMPOSITION, RESIN SHEET, PREPREG, INSULATING MATERIAL, RESIN-SHEET CURED ARTICLE, AND HEAT DISSIPATING MEMBER
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP3305856A1

  公开（公告）日：2018-04-11

  A resin composition contains: a thermosetting resin; a thermally conductive filler; and mica; in which, when the thermally conductive filler is divided into a filler group (A) having a particle diameter of from 10 µm to 100 µm, a filler group (B) having a particle diameter of from 1.0 µm to smaller than 10 µm, and a filler group (C) having a particle diameter of from 0.1 µm to smaller than 1.0 µm, a ratio of the filler group (C) with regard to the thermally conductive filler, based on volume, is larger than a ratio of the filler group (B) with regard to the thermally conductive filler, based on volume.

  一种树脂组合物包含：一种热固性树脂；一种导热填料；以及云母；其中，当导热填料被分为颗粒直径为 10 微米至 100 微米的填料组（A）、颗粒直径为 1.0微米至小于10微米的填料组(B)，以及颗粒直径为0.1微米至小于1.0微米的填料组(C)时，填料组(C)与导热填料的体积比大于填料组(B)与导热填料的体积比。
• RESIN SHEET AND CURED RESIN SHEET
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3418324A1

  公开（公告）日：2018-12-26

  A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

  一种树脂片材包括环氧树脂（包括环氧树脂低聚物和环氧树脂单体）、固化剂和无机填料，其中无机填料的含量按体积计算大于 30%，但小于 80%。
• EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT AND COMPOSITE MATERIAL
  申请人：Showa Denko Materials Co., Ltd.

  公开号：EP3851474A1

  公开（公告）日：2021-07-21

  An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

  环氧树脂包括环氧化合物与具有萘结构和与环氧基团反应的官能团的化合物之间的反应产物。
• EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, AND COMPOSITE MATERIAL
  申请人：Showa Denko Materials Co., Ltd.

  公开号：EP3950760A1

  公开（公告）日：2022-02-09

  An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

  环氧树脂包括以下两者之间的反应产物：具有中生结构的环氧化合物；以及至少一种从以下组别中选出的物质：具有一个羧基和一个羟基并与芳香环键合的芳香族羟基羧酸，以及具有两个羧基并与芳香族基键合的芳香族二羧酸。