1-methyl-3-(phenylamino)pyrrolidine-2,5-dione | 41187-41-1

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 1-methyl-3-(phenylamino)pyrrolidine-2,5-dione
• 英文别名: N-Phenyl-asparaginsaeure-methylimid；2-Anilino-N-methyl-succinimid；N-Methyl-anilinosuccinimid；3-anilino-1-methyl-pyrrolidine-2,5-dione；3-Anilino-1-methylpyrrolidine-2,5-dione
• CAS: 41187-41-1
• 化学式: C₁₁H₁₂N₂O₂
• mdl: MFCD10670662
• 分子量: 204.228
• InChiKey: GISGIFILXOGLJP-UHFFFAOYSA-N

物化性质

• 熔点：
  139-140 °C
• 沸点：
  405.6±38.0 °C(Predicted)
• 密度：
  1.295±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  15
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.272
• 拓扑面积：
  49.4
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  N-Methyl-4-oxo-1-phenylazetidine-2-carboxamide 、 甲烷磺酸 以90%的产率得到
  参考文献：
  名称：

  KANO S.; EBATA T.; DENTA Y.; HIBINO S.; SHIBUYA S., HETEROCYCLES, 1977, 8, SPEC. ISSUE, 411-416

  摘要：

  DOI：

文献信息

• Copper(II)-Catalyzed Synthesis of Pyrrolo[3,4-<i>b</i>]quinolinediones from <i>o</i>-Amino Carbonyl Compounds and Maleimides
  作者：Dhananjay S. Nipate、Krishnan Rangan、Anil Kumar

  DOI：10.1021/acs.orglett.3c00240

  日期：2023.3.3

  A copper(II)-catalyzed cascade synthesis of 1H-pyrrolo[3,4-b]quinoline-1,3(2H)-diones has been achieved from readily available o-amino carbonyl compounds and maleimides. This one-pot cascade strategy involves a copper-catalyzed aza-Michael addition followed by condensation and oxidation to deliver the target molecules. The protocol features a broad substrate scope and excellent functional group tolerance

  铜 (II) 催化的 1 H-吡咯并 [3,4- b ] 喹啉-1,3(2 H )-二酮的级联合成已经从容易获得的邻氨基羰基化合物和马来酰亚胺中实现。这种单锅级联策略涉及铜催化的氮杂-迈克尔加成，然后进行缩合和氧化以传递目标分子。该协议具有广泛的底物范围和出色的官能团耐受性，并提供中等至良好 (44–88%) 产量的产品。
• Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
  申请人：Hitachi Chemical Company, Ltd.

  公开号：US10414943B2

  公开（公告）日：2019-09-17

  Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

  本发明公开了一种热固性树脂组合物，该组合物含有马来酰亚胺化合物（包括具有特定化学结构的不饱和马来酰亚胺化合物）、热固性树脂、无机填料和钼化合物；通过在基材上涂覆含有热固性树脂、二氧化硅和特定钼化合物的热固性树脂组合物，然后进行半固化以形成预浸料，并对预浸料进行层压和成型而获得的布线板用层压板；以及包括特定步骤的树脂组合物清漆的制造方法。根据本发明，可以提供热膨胀性能低、钻孔加工性和耐热性优良的电子元件，例如预浸料、层压板、中间件等。
• Thermosetting resin composition and prepreg and laminate both made with the same
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US10604641B2

  公开（公告）日：2020-03-31

  The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

  本发明提供了一种热固性树脂组合物，该组合物包含（A）二取代膦酸的金属盐；（B）分子中含有一个 N-取代马来酰亚胺基团的马来酰亚胺化合物；（C）6-取代鸟胺化合物或双氰胺；以及（D）分子中含有至少两个环氧基团的环氧树脂。用本发明的热固性树脂组合物浸渍或涂覆基材而得到的预浸料，以及用上述预浸料层压和模塑而得到的层压板，在铜箔粘合性能、玻璃化转变温度、耐焊接热性、吸湿性、阻燃性、相对介电常数和介电损耗正切等方面均达到平衡，可用作电子仪器的印刷线路板。
• THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2518115B1

  公开（公告）日：2017-10-18
• THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME
  申请人：Tsuchikawa Shinji

  公开号：US20100143728A1

  公开（公告）日：2010-06-10

  The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.