Acrylsaeure-(2-hydroxy-1-methylpropylester) | 89941-49-1

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: Acrylsaeure-(2-hydroxy-1-methylpropylester)
• 英文别名: 2-Hydroxy-1-methylpropyl 2-propenoate；3-hydroxybutan-2-yl prop-2-enoate
• CAS: 89941-49-1
• 化学式: C₇H₁₂O₃
• 分子量: 144.17
• InChiKey: QXIQCNFSNJEMOD-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.9
• 重原子数：
  10
• 可旋转键数：
  4
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.57
• 拓扑面积：
  46.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  4,5-dimethyl-2-vinyl-[1,3]dioxolane 在 phthalic acid butyl ester 、 氧气 作用下， 生成 Acrylsaeure-(2-hydroxy-1-methylpropylester)
  参考文献：
  名称：

  Autoxidation of 2-Alkenyldioxolanes and 2-Alkenyl-1,3-dioxanes

  摘要：

  DOI：

  10.1021/jo01025a007

文献信息

• PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE
  申请人：Toray Industries, Inc.

  公开号：EP3267254A1

  公开（公告）日：2018-01-10

  Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.

  本发明提供了一种光敏树脂组合物，其中含有：一种或多种选自聚酰亚胺、聚苯并恶唑、聚酰亚胺前体、聚苯并恶唑前体和两种或多种选自前述物质的聚合物形成的共聚物的碱溶性树脂；以及一种光敏剂。光敏树脂组合物还含有通式（1）所代表的化合物。即使在低温下烧制固化薄膜，光敏树脂组合物也能与金属材料，特别是铜，表现出优异的粘合性能，并具有很高的耐化学性。
• HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT
  申请人：Toray Industries, Inc.

  公开号：EP3284771A1

  公开（公告）日：2018-02-21

  The purpose of the present invention is to provide a heat-resistant resin composition having excellent stepped embedding properties on a support substrate. In order to achieve the aforementioned purpose, the present invention is configured as described below. Specifically, the present invention is a heat-resistant resin composition containing: as a resin (A) one or more types of resin selected from the group consisting of a polyimide precursor, and a polybenzoxazole precursor; as an organic solvent (B) an organic solvent having a boiling point of 210°C to 260°C at atmospheric pressure; and as an organic solvent (C) an organic solvent having a boiling point of 100°C to less than 210°C at atmospheric pressure; the content of the organic solvent (B) being 5% by mass to 70% by mass with respect to the entire amount of the organic solvents, and the content of the organic solvent (C) being 30% by mass to 95% by mass with respect to the entire amount of the organic solvents.

  本发明的目的是提供一种耐热树脂组合物，该组合物在支撑基材上具有优异的阶梯嵌入特性。为了实现上述目的，本发明的结构如下所述。具体地说，本发明是一种耐热树脂组合物，其中含有作为树脂（A）从聚酰亚胺前体和聚苯并恶唑前体组成的组中选出的一种或多种树脂； 作为有机溶剂（B）在常压下沸点为 210℃至 260℃的有机溶剂；以及 作为有机溶剂（C）在常压下沸点为 100℃至 210℃以下的有机溶剂；有机溶剂(B)的含量为有机溶剂总量的 5%至 70%，有机溶剂(C)的含量为有机溶剂总量的 30%至 95%。
• Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10365559B2

  公开（公告）日：2019-07-30

  Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.

  本发明提供了一种光敏树脂组合物，其中含有：一种或多种选自聚酰亚胺、聚苯并恶唑、聚酰亚胺前体、聚苯并恶唑前体和两种或多种选自前述物质的聚合物形成的共聚物的碱溶性树脂；以及一种光敏剂。光敏树脂组合物还含有通式（1）所代表的化合物。即使在低温下烧制固化薄膜，光敏树脂组合物也能与金属材料，特别是铜，表现出优异的粘合性能，并具有很高的耐化学性。
• PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM AND DISPLAY DEVICE
  申请人：Toray Industries, Inc.

  公开号：EP2937732B1

  公开（公告）日：2020-08-19
• RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME
  申请人：Miyoshi Kazuto

  公开号：US20110284855A1

  公开（公告）日：2011-11-24

  The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.