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1-(1-ethoxyethoxy)-4-methylbenzene | 60958-25-0

中文名称
——
中文别名
——
英文名称
1-(1-ethoxyethoxy)-4-methylbenzene
英文别名
——
1-(1-ethoxyethoxy)-4-methylbenzene化学式
CAS
60958-25-0
化学式
C11H16O2
mdl
——
分子量
180.247
InChiKey
FRAAYIYLBFNBJS-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    3
  • 重原子数:
    13
  • 可旋转键数:
    4
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.45
  • 拓扑面积:
    18.5
  • 氢给体数:
    0
  • 氢受体数:
    2

反应信息

  • 作为反应物:
    描述:
    1-(1-ethoxyethoxy)-4-methylbenzene二苯基氯化膦正丁基锂四甲基乙二胺 作用下, 以 乙醚 为溶剂, 反应 2.0h, 生成
    参考文献:
    名称:
    通过设计催化:通过对位配体的组装形成宽咬合角度的二膦,以进行选择性的铑催化的加氢甲酰化。
    摘要:
    DOI:
    10.1002/anie.200701255
  • 作为产物:
    描述:
    对甲酚乙烯基乙醚吡啶三氟乙酸 作用下, 反应 48.0h, 以82%的产率得到1-(1-ethoxyethoxy)-4-methylbenzene
    参考文献:
    名称:
    通过设计催化:通过对位配体的组装形成宽咬合角度的二膦,以进行选择性的铑催化的加氢甲酰化。
    摘要:
    DOI:
    10.1002/anie.200701255
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文献信息

  • FILM-FORMING COMPOSITION CONTAINING CROSSLINKABLE REACTIVE SILICONE
    申请人:Nissan Chemical Industries, Ltd.
    公开号:EP3222688A1
    公开(公告)日:2017-09-27
    There is provided film-forming composition having favorable effects such as curability and embeddability and resist underlayer film for use in lithography process for semiconductor devices. A film-forming composition comprising, as silane, hydrolyzable silane, hydrolysis product thereof, or hydrolysis-condensation product thereof, wherein hydrolyzable silane includes hydrolyzable silane of Formula (1):         R1aR2bSi(R3)4-(a+b)     Formula (1) in Formula (1), R1 is organic group of Formula (2) and is bonded to silicon atom through Si-C bond: Film-forming composition, wherein the hydrolyzable silane is combination of hydrolyzable silane of Formula (1) with another hydrolyzable silane, wherein other hydrolyzable silane is at least one selected from group consisting of hydrolyzable silane of Formula (3):         R7cSi(R8)4-c     Formula (3) and hydrolyzable silane of Formula (4):         (R9dSi(R10)3-d]2Ye     Formula (4) Resist underlayer film, obtained by applying the resist underlayer film-forming composition on semiconductor substrate and baking.
    本发明提供的成膜组合物具有良好的效果,如固化性和嵌入性以及用于半导体器件光刻工艺的抗蚀底层膜。 一种成膜组合物,包括作为硅烷的可硅烷、其解产物或其解缩合产物,其中可硅烷包括式(1)的可硅烷: R1aR2bSi(R3)4-(a+b) 式(1) 在式(1)中,R1 是式(2)的有机基团,并通过 Si-C 键与原子结合: 成膜组合物,其中可硅烷是式(1)的可硅烷与另一种可硅烷的组合,其中另一种可硅烷至少是从式(3)的可硅烷组成的组中选出的一种: R7cSi(R8)4-c 式(3) 和式 (4) 的可硅烷: (R9dSi(R10)3-d]2Ye 式(4) 将抗蚀剂底层成膜组合物涂在半导体衬底上并烘烤而得到的抗蚀剂底层薄膜。
  • PHOTOSENSITIVE TRANSFER MATERIAL, PATTERN FORMATION METHOD, AND ETCHING METHOD
    申请人:FUJIFILM Corporation
    公开号:US20150219993A1
    公开(公告)日:2015-08-06
    A photosensitive transfer material including a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, in which the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).
  • PATTERN FORMING METHOD, ETCHING METHOD AND METHOD FOR PRODUCING CAPACITANCE-TYPE INPUT DEVICE
    申请人:FUJIFILM Corporation
    公开号:US20170199458A1
    公开(公告)日:2017-07-13
    A pattern forming method includes forming a photosensitive resin composition layer on at least one surface of a substrate using a photosensitive transfer material, exposing the photosensitive resin composition layer; and developing the exposed photosensitive resin composition layer, in which the photosensitive transfer material includes a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).
  • COMPOSITION FOR FORMING ORGANIC ANTI-REFLECTIVE COATING LAYER SUITABLE FOR NEGATIVE TONE DEVELOPMENT
    申请人:DONGJIN SEMICHEM CO., LTD.
    公开号:US20170351178A1
    公开(公告)日:2017-12-07
    Provided is a composition for forming an organic anti-reflective coating layer used in a negative tone development, which not only enhance an adhesion to a photoresist while having a high refractive index and a high etch rate but also improve a pattern profile of undercut etc. The composition an isocyanurate compound containing at least one moiety which is represented by Formula 2; a polymer represented by Formula 3 and an organic solvent for dissolving the above-mentioned components.
  • RADIATION SENSITIVE COMPOSITION
    申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
    公开号:US20180181000A1
    公开(公告)日:2018-06-28
    A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1) R 1 a R 2 b Si(R 3 ) 4-(a+b) Formula (1) wherein R 1 is an organic group of Formula (1-2) and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R 3 is a hydrolyzable group; and Formula (2) R 7 c R 8 d Si(R 9 ) 4-(c+d) Formula (2) wherein R 7 is an organic group of Formula (2-1) and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R 9 is a hydrolyzable group.
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