Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
申请人:SHENGYI TECHNOLOGY CO., LTD.
公开号:US10400099B2
公开(公告)日:2019-09-03
The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.
本发明涉及一种无卤环氧树脂组合物、一种预浸料、一种层压板和一种含有无卤环氧树脂组合物的印刷电路板。无卤环氧树脂组合物包括环氧树脂和固化剂。环氧树脂中环氧基团的总当量为 1,固化剂中与环氧基团反应的活性基团的当量为 0.5-0.95。通过控制环氧树脂中环氧基团与固化剂中活性基团的当量比为 0.5-0.95,本发明可确保预浸料在不同固化温度条件下的 Df 值稳定性,同时保持低介电常数和低介电损耗。用该树脂组合物制备的预浸料和层压板具有低介电常数、低介电损耗、优异的阻燃性、耐热性、粘合性、低吸水性和防潮性等综合性能,适用于无卤多层电路板。