An object of the present invention is to provide a composition for forming a thermally conductive material, from which a thermally conductive material having excellent thermally conductive properties can be obtained. In addition, another object of the present invention is to provide a thermally conductive material formed of the composition for forming a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.
A composition for forming a thermally conductive material of the present invention includes an epoxy compound, an inorganic substance, and a compound X containing one or more functional groups selected from the group consisting of an alkenyl group, an acrylate group, a methacrylate group, a silyl group, an acid anhydride group, a cyanate ester group, an amino group, a thiol group, and a carboxylic acid group, or having a polyamic acid structure, in which a content of the inorganic substance is 10% by mass or more with respect to a total solid content of the composition, and a content of the compound X is 10% by mass or more with respect to the total solid content of the composition.
本发明的一个目的是提供一种用于形成导热材料的组合物,通过该组合物可以获得具有优异导热性能的导热材料。此外,本发明的另一个目的是提供一种由该用于形成导热材料的组合物形成的导热材料、导热片材和带有导热层的装置。
本发明的一种用于形成导热材料的组合物包括环氧化合物、无机物和含有一个或多个官能团的化合物 X,这些官能团选自由烯基、
丙烯酸酯基、
甲基丙烯酸酯基、
硅烷基、酸酐基、
氰酸酯基、
氨基、
硫醇基组成的组、
氨基、
硫醇基和
羧酸基,或具有聚酰胺酸结构,其中无机物的含量为组合物固体总含量的 10%(以质量计)或以上,而化合物 X 的含量为组合物固体总含量的 10%(以质量计)或以上。