1-methyl-cyclohexa-2,4-diene-1,2-dicarboxylic acid-anhydride | 99595-82-1

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 1-methyl-cyclohexa-2,4-diene-1,2-dicarboxylic acid-anhydride
• 英文别名: 1-Methyl-cyclohexa-2,4-dien-1,2-dicarbonsaeure-anhydrid；3a-methyl-4H-2-benzofuran-1,3-dione
• CAS: 99595-82-1
• 化学式: C₉H₈O₃
• 分子量: 164.161
• InChiKey: WPQNZHSRPFPLOZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  12
• 可旋转键数：
  0
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  43.4
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  (+/-)-3c-acetoxy-1-methyl-cyclohex-4-ene-1r,2c-dicarboxylic acid-anhydride 生成 1-methyl-cyclohexa-2,4-diene-1,2-dicarboxylic acid-anhydride
  参考文献：
  名称：

  Kutscherow et al., Zhurnal Obshchei Khimii, 1959, vol. 29, p. 793,800; engl. Ausg. S. 781, 786

  摘要：

  DOI：

文献信息

• Heat-conductive paste
  申请人：SUMITOMO BAKELITE COMPANY LIMITED

  公开号：EP0845499A2

  公开（公告）日：1998-06-03

  The object of the present invention is to provide a paste for bonding a semiconductor, which has excellent low stress and excellent heat conductivity and is useful industrially. The object has been achieved by a heat-conductive paste comprising (A) an epoxy resin which is liquid at room temperature and which has at least two epoxy groups in the molecule, (B) an epoxy group-containing reactive diluent having a viscosity of 100 cp or less at room temperature, (C) a phenolic compound as a curing agent represented by the following general formula (1), which is crystalline at room temperature: wherein R is hydrogen atom or an alkyl group of 1-5 carbon atoms, and (D) a silver powder, wherein the amount of the silver powder (D) is 70-90% by weight of the total paste; the silver powder (D) contains an atomized silver powder consisting of flake-shaped particles having longitudinal lengths ranging from 10 µ to 50 µ and thicknesses ranging from 1 µ to 5 µ, in an amount of at least 30% by weight of the total silver powder; and the paste is produced by first melt-mixing the component (C) with the components (A) and (B) or with the component (B), and then kneading the resulting mixture with the component (D) or with the components (D) and (A).

  本发明的目的是提供一种用于粘接半导体的浆料，它具有优异的低应力和优良的导热性，在工业上非常有用。实现这一目标的导热浆料包括 (A) 环氧树脂，在室温下呈液态，分子中至少有两个环氧基团、 (B) 含环氧基团的活性稀释剂，室温下粘度为 100 cp 或更低、 (C) 作为固化剂的酚类化合物，由以下通式（1）表示，在室温下呈结晶状： 其中 R 为氢原子或 1-5 个碳原子的烷基，以及 (D) 银粉、 其中，银粉（D）的用量为浆料总量的 70-90%（按重量计）；银粉（D）包含由片状颗粒组成的雾化银粉，其纵向长度为 10 µ 至 50 µ，厚度为 1 µ 至 5 µ，用量至少为银粉总量的 30%（按重量计）；首先将组分（C）与组分（A）和（B）或与组分（B）熔融混合，然后将所得混合物与组分（D）或与组分（D）和（A）捏合，制成糊状物。
• HEAT CURABLE RESIN COMPOSITION FOR LIGHT REFLECTION, PROCESS FOR PRODUCING THE RESIN COMPOSITION, AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2100908A1

  公开（公告）日：2009-09-16

  This invention provides a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100°C to 200°C, molding pressure of not more than 20MPa, and molding time of 60 to 120 sec is not more than 5mmabd the light reflectance after heat curing at a wavelength of 350 nm to 800nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

  本发明提供了一种光反射用热固性树脂组合物，固化后可实现从可见光到近紫外光范围内的高反射率，具有优异的耐热劣化性和平板成型性，并且在转移成型时不易产生毛刺，还提供了该树脂组合物的生产工艺，以及使用该树脂组合物的光半导体元件安装基板和光半导体器件。光反射用热固化树脂组合物由热固化成分和白色颜料组成，其特征在于，在成型温度为 100℃至 200℃、成型压力不超过 20MPa、成型时间为 60 秒至 120 秒的条件下，转移成型时产生的毛刺长度不超过 5mmabd，在波长为 350nm 至 800nm 的条件下，热固化后的光反射率不低于 80%。该树脂组合物可用于制造光半导体元件安装基板和光半导体器件。
• Curable Epoxy Resin Composition
  申请人：ABB Research Ltd.

  公开号：EP2230267A1

  公开（公告）日：2010-09-22

  Curable epoxy resin composition comprising an epoxy resin component and a filler component and optionally a hardener component and further additives, wherein (a) said curable epoxy resin composition has been produced by separately mixing together at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives, previously to mixing theses components with the optional hardener component and with any remaining optional additives present in the curable epoxy resin composition, and that (b) said mixing together of at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives has been carried out at a temperature higher than the casting temperature of the curable epoxy resin composition, and electrical insulation systems made therefrom.

  可固化环氧树脂组合物，包括环氧树脂组分和填料组分，以及可选的固化剂组分和其他添加剂，其中 (a) 所述可固化环氧树脂组合物是通过将至少一部分环氧树脂组分和至少一部分填料组分，以及可选的部分或全部添加剂分别混合在一起而制成的、(b) 至少一部分环氧树脂组分和至少一部分填料组分以及部分或全部可选添加剂的混合是在高于可固化环氧树脂组合物浇注温度的条件下进行的。
• INTERNAL COMBUSTION ENGINE IGNITION COIL AND METHOD FOR MANUFACTURING INTERNAL COMBUSTION ENGINE IGNITION COIL
  申请人：Hitachi Automotive Systems Hanshin, Ltd.

  公开号：EP3208815A1

  公开（公告）日：2017-08-23

  An internal combustion engine ignition coil according to the present invention includes: a central iron core 6; a primary coil 3 disposed on an outer circumference of the central iron core; a secondary coil 5 disposed on an outer circumference of the primary coil; a side iron core disposed on an outer circumference of the secondary coil; and an insulating material sealing the central iron core 6, the primary coil 3, and the secondary coil 5 on an inner side of the side iron core. A first layered silicate having a particle diameter less than a winding diameter of the secondary coil is present at a higher concentration in a vicinity of the secondary coil than that in a vicinity of the side iron core in the insulating material. A second layered silicate having a particle diameter greater than the winding diameter of the secondary coil 5 is present at a higher concentration than that of the first layered silicate between the outer circumference side of the secondary coil 5 and the side iron core. The second layered silicate has an aspect ratio of 50 or more, the aspect ratio being a ratio of a long side of a particle of the layered silicate to a thickness of the particle.

  根据本发明，内燃机点火线圈包括：中心铁芯6；设置在中心铁芯外周的初级线圈3；设置在初级线圈外周的次级线圈5；设置在次级线圈外周的侧铁芯；以及在侧铁芯内侧密封中心铁芯6、初级线圈3和次级线圈5的绝缘材料。在绝缘材料中，颗粒直径小于次级线圈绕组直径的第一层硅酸盐在次级线圈附近的浓度高于在侧铁芯附近的浓度。颗粒直径大于次级线圈 5 绕组直径的第二层硅酸盐在次级线圈 5 的外圆周侧与侧铁芯之间的浓度高于第一层硅酸盐。第二层硅酸盐的长宽比为 50 或以上，长宽比是指层状硅酸盐颗粒的长边与颗粒厚度之比。
• IGNITION COIL FOR INTERNAL COMBUSTION ENGINE
  申请人：Hitachi Automotive Systems Hanshin, Ltd.

  公开号：EP3346477A1

  公开（公告）日：2018-07-11

  An ignition coil (1) for an internal combustion engine includes an iron core, a primary coil (3) disposed around the iron core, a secondary coil (5) disposed around the primary coil (3), and an insulating portion (10) sealing the iron core, the primary coil (3), and the secondary coil (5). The insulating portion (10) includes a resin and a linear aliphatic group-containing organic substance, and has a sea-island structure in which the organic substance is dispersed in a matrix of the resin.

  用于内燃机的点火线圈（1）包括一个铁芯、一个围绕铁芯布置的初级线圈（3）、一个围绕初级线圈（3）布置的次级线圈（5）以及一个密封铁芯、初级线圈（3）和次级线圈（5）的绝缘部分（10）。绝缘部分（10）包括树脂和含有线性脂肪族基团的有机物质，并具有海岛结构，其中有机物质分散在树脂的基体中。