[4-[2-[4-[[4,6-Bis[4-[2-(4-cyanatophenyl)propan-2-yl]phenoxy]-1,3,5-triazin-2-yl]oxy]phenyl]propan-2-yl]phenyl] cyanate | 138024-16-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: [4-[2-[4-[[4,6-Bis[4-[2-(4-cyanatophenyl)propan-2-yl]phenoxy]-1,3,5-triazin-2-yl]oxy]phenyl]propan-2-yl]phenyl] cyanate
• CAS: 138024-16-5
• 化学式: C₅₁H₄₂N₆O₆
• 分子量: 834.931
• InChiKey: FMQXABRXDDCHKI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  14
• 重原子数：
  63
• 可旋转键数：
  15
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  165
• 氢给体数：
  0
• 氢受体数：
  12

反应信息

• 作为产物：
  描述：

  2,2-双(4-氰氧苯基)丙烷 在 3,3'-[Oxydi(4,1-phenylene)]bis(3,4-dihydro-2H-1,3-benzoxazine) 、 丁酮 作用下， 反应 2.0h， 生成 [4-[2-[4-[[4,6-Bis[4-[2-(4-cyanatophenyl)propan-2-yl]phenoxy]-1,3,5-triazin-2-yl]oxy]phenyl]propan-2-yl]phenyl] cyanate
  参考文献：
  名称：

  苯并恶嗪/氰酸酯混合物中氰酸酯快速三聚的起源

  摘要：

  几位研究人员已经独立研究了氰酸酯和苯并恶嗪的混合物，并报道了不同的​​反应机理。最近，我们出乎意料地观察到，在30°C下放置24小时后，P-oda / BACY（1/1 mol / mol）共混物的50 wt％甲基乙基酮溶液中发生了凝胶化，其中P-oda为4,4 ′-氧苯胺/苯酚基苯并恶嗪和BACY是双酚A的二氰酸酯。以前的研究表明，混合物中氰酸酯的快速三聚与苯并恶嗪的开环结构有关。但是，苯并恶嗪在30℃开环聚合的可能性很少。因此，催化作用很可能是由苯并恶嗪本身而不是由苯并恶嗪的开环结构引起的。通过IR和DSC分析，

  DOI：

  10.1021/acs.macromol.5b00334

文献信息

• New thermostable heterocyclic binders and environmentally friendly technologies of production of composite materials
  作者：R. R. Mukhametov、K. R. Akhmadieva、L. V. Chursova

  DOI：10.1134/s1070363211050355

  日期：2011.5

  Synthesis and processing of high-strength and high-heat-resistant polymer matrices (binders) have been studied. Structural composite materials stable up to 400A degrees C have been developed. Processing of the binders is carried out by ecologically safe technologies.
• SOLDERING PASTE FLUX AND SOLDERING PASTE
  申请人：Hamagawa Teruyoshi

  公开号：US20140083567A1

  公开（公告）日：2014-03-27

  The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.
• RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
  申请人：Showa Denko Materials Co., Ltd.

  公开号：US20210235582A1

  公开（公告）日：2021-07-29

  The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.
• EPOXY RESIN COMPOSITION
  申请人：BASF SE

  公开号：US20210395513A1

  公开（公告）日：2021-12-23

  A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.
• [EN] LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS<br/>[FR] COMPOSITIONS DE MOULAGE OU D'ENCAPSULATION PAR COMPRESSION DE LIQUIDE
  申请人：HENKEL IP & HOLDING GMBH

  公开号：WO2020037199A1

  公开（公告）日：2020-02-20

  Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.